Abstract: An apparatus for manufacturing semiconductors includes a power amplifier to power a laser, a catalyst disposed in the power amplifier, an inlet port, and an exhaust port. The inlet port introduces a mixing gas to an interior of the power amplifier during a cleaning operation so that the mixing gas contacts a surface of the catalyst having a build-up thereon. The mixing gas reacts with and removes the build-up by generating gaseous by-products. The exhaust port removes the gaseous by-products from the power amplifier.

Abstract: An apparatus for manufacturing semiconductors includes a power amplifier to power a laser, a catalyst disposed in the power amplifier, an inlet port, and an exhaust port. The inlet port introduces a mixing gas to an interior of the power amplifier during a cleaning operation so that the mixing gas contacts a surface of the catalyst having a build-up thereon. The mixing gas reacts with and removes the build-up by generating gaseous by-products. The exhaust port removes the gaseous by-products from the power amplifier.

Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.

Abstract: A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads.

Abstract: A system and method for testing CMOS image sensors includes a test supporter, a light source controller, an interface card and an image processor. The test supporter supports a CMOS image sensor under test. The light source controller provides a test light to the CMOS image sensor under test. The interface card includes a signal processor and an output port. The signal processor receives a testing data from the CMOS image sensor under test and processes corresponding output data to the output port according to a predetermined output mode. The image processor determines the output mode, and has an input port corresponding to the output port for receiving the output data from the interface card. The image processor determines whether the CMOS image sensor under test is good or not. Therefore, the system can utilize image processors manufactured by various test system manufacturers so as to broaden compatibility.

Abstract: The invention relates to a system and method for testing CMOS image sensor. The system for testing CMOS image sensor comprises: a test supporter, a light source controller, an interface card and an image processor. The test supporter is used to support a CMOS image sensor under test. The light source controller provides a test light to the CMOS image sensor under test. The interface card comprises a signal processor and an output port. The signal processor is used for receiving a testing data from the CMOS image sensor under test and for processing corresponding output data to the output port according to a predetermined output mode. The image processor determines the output mode, and has an input port corresponding to the output port so as to receive the output data from the interface card. The image processor is used to determine whether the CMOS image sensor under test is good or not.