Patents by Inventor Heng-Min Liu

Heng-Min Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shock absorbing structure adapted for a circuit board of an electronic device and electronic device therewith
    Patent number: 10368454
    Abstract: A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: July 30, 2019
    Assignee: Wistron Corporation
    Inventors: Heng-Min Liu, Chun-Wang Lin, Chin-Chung Hung, Tsung-Hsien Chen, Shih-Wei Tung
  • SHOCK ABSORBING STRUCTURE ADAPTED FOR A CIRCUIT BOARD OF AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREWITH
    Publication number: 20180270965
    Abstract: A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.
    Type: Application
    Filed: August 15, 2017
    Publication date: September 20, 2018
    Inventors: Heng-Min Liu, Chun-Wang Lin, Chin-Chung Hung, Tsung-Hsien Chen, Shih-Wei Tung