Patents by Inventor Heng-Ming Nien
Heng-Ming Nien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240023251Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.Type: ApplicationFiled: August 30, 2022Publication date: January 18, 2024Applicant: UNIMICRON TECHNOLOGY CORP.Inventors: Shao-Chien LEE, Ching-Sheng CHEN, Heng-Ming NIEN, Pei-Wei WANG
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Patent number: 11859302Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.Type: GrantFiled: March 28, 2022Date of Patent: January 2, 2024Assignee: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan, Shih-Lian Cheng
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Publication number: 20230389172Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Patent number: 11792918Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.Type: GrantFiled: November 21, 2021Date of Patent: October 17, 2023Assignee: Unimicron Technology Corp.Inventors: Pei-Wei Wang, Heng-Ming Nien, Ching-Sheng Chen, Yi-Pin Lin, Shih-Liang Cheng
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Patent number: 11785707Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.Type: GrantFiled: October 8, 2021Date of Patent: October 10, 2023Assignee: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
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Patent number: 11686008Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.Type: GrantFiled: May 16, 2022Date of Patent: June 27, 2023Assignee: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Cho-Ying Wu, Shih-Lian Cheng
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Publication number: 20230124913Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.Type: ApplicationFiled: March 28, 2022Publication date: April 20, 2023Applicant: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan, Shih-Lian Cheng
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Publication number: 20230120741Abstract: Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.Type: ApplicationFiled: March 22, 2022Publication date: April 20, 2023Applicant: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Cho-Ying Wu, Shih-Lian Cheng
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Publication number: 20230124732Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.Type: ApplicationFiled: May 16, 2022Publication date: April 20, 2023Applicant: Unimicron Technology Corp.Inventors: Heng-Ming Nien, Chih-Chiang Lu, Cho-Ying Wu, Shih-Lian Cheng
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Publication number: 20220240368Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.Type: ApplicationFiled: November 21, 2021Publication date: July 28, 2022Inventors: Pei-Wei WANG, Heng-Ming NIEN, Ching-Sheng CHEN, Yi-Pin LIN, Shih-Liang CHENG
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Publication number: 20220232694Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.Type: ApplicationFiled: October 8, 2021Publication date: July 21, 2022Applicant: Unimicron Technology Corp.Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng