Patents by Inventor HENG-RUI CHANG

HENG-RUI CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230266364
    Abstract: The disclosure provides a probe card comprising a circuit substrate, a space transformer, and a first coaxial cable. The circuit substrate has a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface. The space transformer is arranged on the second surface corresponding to the through hole and has a probe setting surface opposite to the second surface. The first coaxial cable has a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 24, 2023
    Applicant: Silicon Future Manufacturing Company Ltd.
    Inventors: CHIA-HSIANG YU, YOU-CHEN LIN, NENG-KAN CHU, HENG-RUI CHANG, TIEN-CHIA LEE, WEN-TSUNG SUNG