Patents by Inventor Heng-Ting Liu

Heng-Ting Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sliding type thin fingerprint sensor package
    Patent number: 7953257
    Abstract: A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: May 31, 2011
    Assignee: Chipbond Technology Corporation
    Inventors: Yeh-Shun Chen, Yung-Jen Chen, Lin-Hsin Chen, Hua-Ping Chen, Heng-Ting Liu
  • Sliding type thin fingerprint sensor package
    Publication number: 20090103787
    Abstract: A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.
    Type: Application
    Filed: October 23, 2007
    Publication date: April 23, 2009
    Inventors: Yeh-Shun Chen, Yung-Jen Chen, Lin-Hsin Chen, Hua-Ping Chen, Heng-Ting Liu