Patents by Inventor Heng-Tsung Wang

Heng-Tsung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink
    Publication number: 20060102320
    Abstract: A heat sink is disclosed. A plurality of fins is radially and uniformly connected to a central base. Each fin comprises a plurality of protrusions. The protrusions are uniformly formed on each fin around the circumference of the central base.
    Type: Application
    Filed: October 4, 2005
    Publication date: May 18, 2006
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang
  • Thermal module
    Patent number: D509194
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: September 6, 2005
    Assignee: ASUSTek Computer Inc.
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang
  • Thermal module
    Patent number: D510324
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: October 4, 2005
    Assignee: ASUSTek Computer Inc.
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang
  • Thermal module
    Patent number: D510325
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: October 4, 2005
    Assignee: ASUSTek Computer Inc.
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang