Abstract: Provided is use of a SMO inhibitor in the preparation of a drug for preventing, delaying or alleviating access stenosis of arteriovenous fistula. It is creatively found herein that a SMO inhibitor can protect endothelial cells under the stimulation of high glucose and alleviate endothelial cell dysfunction, and specifically reduce lactate dehydrogenase (LDH), reduce apoptosis and reduce the production of inflammatory cytokines TNF-?, MCP-1, and IL-6. Furthermore, it is found herein that the SMO inhibitor can improve endothelial cell dysfunction by increasing the blood flow velocity in blood vessels, increasing the inner diameter of the blood vessel, improving the vascular intima thickening and reducing the production of inflammatory cytokines, thereby achieving the purpose of preventing, delaying or alleviating the access stenosis of arteriovenous fistula.

Abstract: An electric folding device for exterior rear-view mirror of a vehicle is provided which comprises a centralized connection piece, having a mounting portion provided for the drive gear to slide circumferentially; a limiting seat is integrally disposed on an upper part of the mounting portion, a spring is abutted against an upper end of the limiting seat; the drive gear is abutted between the limiting seat and the base. In an initial state, a reserved gap is present between the drive gear and the limiting seat/the base; the electric drive unit drives the base cam assembly to gradually slide relative to the seat cam assembly; the reserved gap is gradually eliminated until the base cam assembly is abutted against the seat cam assembly as the base is lifted up, achieving a smooth lifting function, with low requirements for the bearing capacity of gear, suitable for lightweight development, and cost-effective.

Abstract: An electric folding device for an outer rearview mirror includes a shell, a foundation bed, a base, a pin shaft, an electric driving unit used for driving the shell to rotate relative to the base around the axis of the pin shaft. A spring is arranged on the pin shaft in a sleeving mode, and a connecting piece is provided, which makes the shell manually rotate relatively to the foundation bed. A cam assembly is provided among the connecting piece, the foundation bed and the base. During the electric folding process, driven by the electric driving unit, the cam assembly enables the foundation bed to lift up and rotate along the pin shaft through the relative slide of the cam assembly and the elastic force of the spring. The device is compact in structure with better anti-jitter performance and smooth electric folding.

Abstract: The present disclosure discloses an electric folding device for outer rearview mirror of a vehicle, which includes a shell, a foundation bed, a base, a pin shaft, an electric driving unit used for driving the shell to rotate relatively to the base around the axis of the pin shaft a spring arranged on the pin shaft in a sleeving mode, and a connecting piece which makes the shell manually rotate relatively to the foundation bed. A cam assembly is provided among the connecting piece, the foundation bed and the base. During the electric folding process, driven by the electric driving unit, the cam assembly enables the, foundation bed to lift up and rotate along the pin shaft through the relative slide of the cam assembly and the elastic force of the spring. The device is compact in structure, with better anti-jitter performance, smooth electric folding process, and less folding failure.

Abstract: An electronic component and method of making an electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: An electronic component and method of making an electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: A lead frame (1) has a first portion (2) adapted to have a semiconductor device (10) mounted thereon and a second portion (3) including a main member (5), a number of first contact members (6) and a number of second contact members (7). The first and second contact members (6, 7) depend from the main member (5). The second portion (3) at least partially surrounds the first portion (6). The first contact members (6) extend form the main member (5) in a direction away for the first portion (2) and the second contact members (7) extend from the main member (5) in a direction towards the first portion (2).

Abstract: An electronic component and a system carrier having a heat conduction block, on which overlapping inner flat conductor ends are fixed mechanically and insulated electrically by an organoceramic layer (6). In addition, methods of producing the system carrier and the electronic component are encompassed.

Abstract: The present invention relates to an electronic component (5) and a system carrier having a heat conduction block (3), on which overlapping inner flat conductor ends (4) are fixed mechanically and insulated electrically by means of an organoceramic layer (6). In addition, the invention relates to a method of producing the system carrier and the electronic component.

Abstract: A lead frame (1) has a first portion (2) adapted to have a semiconductor device (10) mounted thereon and a second portion (3) including a main member (5), a number of first contact members (6) and a number of second contact members (7). The first and second contact members (6, 7) depend from the main member (5). The second portion (3) at least partially surrounds the first portion (6). The first contact members (6) extend form the main member (5) in a direction away for the first portion (2) and the second contact members (7) extend from the main member (5) in a direction towards the first portion (2).