Patents by Inventor Heng Wan Jenny Hong

Heng Wan Jenny Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip

Patent number: 6841857

Abstract: An electronic component and a system carrier having a heat conduction block, on which overlapping inner flat conductor ends are fixed mechanically and insulated electrically by an organoceramic layer (6). In addition, methods of producing the system carrier and the electronic component are encompassed.

Type: Grant

Filed: July 18, 2002

Date of Patent: January 11, 2005

Assignee: Infineon Technologies AG

Inventors: Gottfried Beer, Robert Bergmann, Heng Wan Jenny Hong
Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip

Publication number: 20030038346

Abstract: The present invention relates to an electronic component (5) and a system carrier having a heat conduction block (3), on which overlapping inner flat conductor ends (4) are fixed mechanically and insulated electrically by means of an organoceramic layer (6). In addition, the invention relates to a method of producing the system carrier and the electronic component.

Type: Application

Filed: July 18, 2002

Publication date: February 27, 2003

Inventors: Gottfried Beer, Robert Bergman, Heng Wan Jenny Hong

Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip

Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip