Abstract: An alignment nozzle jig for centering a coater photoresist arm that includes an alignment nozzle block. The alignment nozzle jig also includes an endoscope holder removably secured to a bottom of the alignment nozzle block, an endoscope, and an alignment mark removably coupled to the endoscope holder opposite the alignment nozzle block. The alignment nozzle jig is retrieved from a nozzle bath by the coater arm and transferred to a center of a chuck in an associated process chamber. Via the endoscope, the coater photoresist arm is aligned with the center of the chuck using the alignment mark.

Abstract: An alignment nozzle jig for centering a coater photoresist arm that includes an alignment nozzle block. The alignment nozzle jig also includes an endoscope holder removably secured to a bottom of the alignment nozzle block, an endoscope, and an alignment mark removably coupled to the endoscope holder opposite the alignment nozzle block. The alignment nozzle jig is retrieved from a nozzle bath by the coater arm and transferred to a center of a chuck in an associated process chamber. Via the endoscope, the coater photoresist arm is aligned with the center of the chuck using the alignment mark.

Abstract: A wafer handler cleaning tool may include a scraping device positioned near semiconductor equipment (e.g., a cooling plate, a semiconductor processing device, and/or the like) such that the scraping device removes foreign objects, debris, and/or other types of matter from the underside of the wafer handler when the wafer handler loads a wafer into the semiconductor equipment and/or unloads the wafer from the semiconductor equipment. Moreover, the wafer handler cleaning tool may include a negative pressure device to draw the removed foreign objects, debris, and/or other types of matter away from the scraping device and toward a filtration device such that the filtration device captures the removed foreign objects, debris, and/or other types of matter.

Abstract: An alignment nozzle jig for centering a coater photoresist arm that includes an alignment nozzle block. The alignment nozzle jig also includes an endoscope holder removably secured to a bottom of the alignment nozzle block, an endoscope, and an alignment mark removably coupled to the endoscope holder opposite the alignment nozzle block. The alignment nozzle jig is retrieved from a nozzle bath by the coater arm and transferred to a center of a chuck in an associated process chamber. Via the endoscope, the coater photoresist arm is aligned with the center of the chuck using the alignment mark.

Abstract: A wafer handler cleaning tool may include a scraping device positioned near semiconductor equipment (e.g., a cooling plate, a semiconductor processing device, and/or the like) such that the scraping device removes foreign objects, debris, and/or other types of matter from the underside of the wafer handler when the wafer handler loads a wafer into the semiconductor equipment and/or unloads the wafer from the semiconductor equipment. Moreover, the wafer handler cleaning tool may include a negative pressure device to draw the removed foreign objects, debris, and/or other types of matter away from the scraping device and toward a filtration device such that the filtration device captures the removed foreign objects, debris, and/or other types of matter.