Patents by Inventor Heng YAO

Heng YAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967594
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes a stack of semiconductor layers spaced apart from and aligned with each other, a first source/drain epitaxial feature in contact with a first one or more semiconductor layers of the stack of semiconductor layers, and a second source/drain epitaxial feature disposed over the first source/drain epitaxial feature. The second source/drain epitaxial feature is in contact with a second one or more semiconductor layers of the stack of semiconductor layers. The structure further includes a first dielectric material disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature and a first liner disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature. The first liner is in contact with the first source/drain epitaxial feature and the first dielectric material.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Cheng Chen, Zhi-Chang Lin, Jung-Hung Chang, Lo Heng Chang, Chien Ning Yao, Kuo-Cheng Chiang, Chih-Hao Wang
  • Patent number: 11966170
    Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ai-Jen Hung, Yung-Yao Lee, Heng-Hsin Liu, Chin-Chen Wang, Ying Ying Wang
  • Publication number: 20240111191
    Abstract: The present disclosure provides a display substrate, including an array substrate, a color filter substrate, and a liquid crystal layer and a sealant arranged therebetween. A sealing cavity for receiving the liquid crystal layer is defined by the sealant, the array substrate and the color filter substrate. The display substrate is provided with a bonding side surface bonded to a chip on film, the sealant at least includes a first portion including a first side surface and a second side surface flush with the bonding side surface. The array substrate includes a display region and a non-display region surrounding the display region. A bonding pin is provided in the non-display region, extends to a side surface of the display substrate, and is exposed to the outside. The present disclosure further provides a method for manufacturing the display substrate, a display motherboard, and a display device.
    Type: Application
    Filed: April 29, 2021
    Publication date: April 4, 2024
    Inventors: Jiarong LIU, Heng WANG, Zhixiao YAO
  • Publication number: 20240100479
    Abstract: The present disclosure relates to analysis of Hg(II) isotopes in the aqueous phase, and provides an in-situ enrichment method and an analytical method for Hg(II) isotopes in the aqueous phase. The in-situ enrichment method includes the following steps: conducting adsorption in the water sample by a diffusive gradient in thin-films (DGT) device to obtain an Hg(II)-adsorbed DGT device; where a binding gel of the DGT device is an NSBA gel; conducting elution on the NSBA gel in the Hg(II)-adsorbed DGT device to acquire an Hg(II)-containing eluate with a mercury concentration higher than or equal to 0.5 ng/mL; where the elution is carried out with an eluent of reverse aqua regia. In the in-situ enrichment method, the NSBA-DGT device only needs to be placed in the water sample to be investigated to perform in-situ Hg(II) adsorption without direct grab sampling.
    Type: Application
    Filed: April 26, 2023
    Publication date: March 28, 2024
    Inventors: Heng Yao, Hongqian Yin, Xinbin Feng, Jun Luo
  • Patent number: 11942396
    Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 26, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Heng-Chieh Chien, Shu-Jung Yang, Yu-Min Lin, Chih-Yao Wang, Yu-Lin Chao
  • Patent number: 11929287
    Abstract: The present disclosure describes a semiconductor structure with a dielectric liner. The semiconductor structure includes a substrate and a fin structure on the substrate. The fin structure includes a stacked fin structure, a fin bottom portion below the stacked fin structure, and an isolation layer between the stacked fin structure and the bottom fin portion. The semiconductor structure further includes a dielectric liner in contact with an end of the stacked fin structure and a spacer structure in contact with the dielectric liner.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zhi-Chang Lin, Shih-Cheng Chen, Kuo-Cheng Chiang, Kuan-Ting Pan, Jung-Hung Chang, Lo-Heng Chang, Chien Ning Yao
  • Patent number: 11916122
    Abstract: A method for forming a gate all around transistor includes forming a plurality of semiconductor nanosheets. The method includes forming a cladding inner spacer between a source region of the transistor and a gate region of the transistor. The method includes forming sheet inner spacers between the semiconductor nanosheets in a separate deposition process from the cladding inner spacer.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zhi-Chang Lin, Kuan-Ting Pan, Shih-Cheng Chen, Jung-Hung Chang, Lo-Heng Chang, Chien-Ning Yao, Kuo-Cheng Chiang
  • Publication number: 20240054968
    Abstract: The disclosure provides a display driving device and a display control device and an operation method thereof. The display control device includes a data analyzing circuit and a data compensation circuit. The data analyzing circuit performs arithmetic operation on multiple sub-pixel data output by a target driving channel of a source driver in a current frame to obtain a resultant value corresponding to the target driving channel. The data compensation circuit determines at least one compensation grayscale value corresponding to the resultant value. The compensation grayscale value is to be displayed by the target driving channel in a vertical blank period of a frame period in which the current frame is displayed. The target driving channel of the source driver outputs at least one compensation voltage corresponding to the at least one compensation grayscale value in the vertical blank period of the frame period.
    Type: Application
    Filed: August 9, 2022
    Publication date: February 15, 2024
    Applicant: Novatek Microelectronics Corp.
    Inventors: Fu-Jung Wen, Heng-Yao Lin, Yen-Tao Liao, Jen-Ta Yang, Yu-Hung Su
  • Patent number: 11887552
    Abstract: The disclosure provides a display driving device and a display control device and an operation method thereof. The display control device includes a data analyzing circuit and a data compensation circuit. The data analyzing circuit performs arithmetic operation on multiple sub-pixel data output by a target driving channel of a source driver in a current frame to obtain a resultant value corresponding to the target driving channel. The data compensation circuit determines at least one compensation grayscale value corresponding to the resultant value. The compensation grayscale value is to be displayed by the target driving channel in a vertical blank period of a frame period in which the current frame is displayed. The target driving channel of the source driver outputs at least one compensation voltage corresponding to the at least one compensation grayscale value in the vertical blank period of the frame period.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: January 30, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Fu-Jung Wen, Heng-Yao Lin, Yen-Tao Liao, Jen-Ta Yang, Yu-Hung Su
  • Publication number: 20230298220
    Abstract: An image processing method including the following steps is provided. An image information of an image is received, wherein the image includes a plurality of blocks and the image information includes a plurality of pixel information of each block. A dual gamma correction is performed on a first group of blocks of the image to obtain one or more corrected blocks and the dual gamma correction is skipped on a second group of blocks of the image to obtain a plurality of uncorrected blocks. A first encoding process is performed on the one or more corrected blocks to obtain a plurality of first encoded blocks. A second encoding process different from the first encoding process is performed on the plurality of uncorrected blocks to obtain a plurality of second encoded blocks.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Applicant: Novatek Microelectronics Corp.
    Inventors: Hui-Yu Jiang, Heng-Yao Lin, Yen-Tao Liao
  • Patent number: 11741636
    Abstract: An image processing method including the following steps is provided. An image information of an image is received, wherein the image includes a plurality of blocks and the image information includes a plurality of pixel information of each block. A dual gamma correction is performed on a first group of blocks of the image to obtain one or more corrected blocks and the dual gamma correction is skipped on a second group of blocks of the image to obtain a plurality of uncorrected blocks. A first encoding process is performed on the one or more corrected blocks to obtain a plurality of first encoded blocks. A second encoding process different from the first encoding process is performed on the plurality of uncorrected blocks to obtain a plurality of second encoded blocks.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 29, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventors: Hui-Yu Jiang, Heng-Yao Lin, Yen-Tao Liao
  • Patent number: 11737234
    Abstract: A mounting kit adapted for a rail component is provided and includes a mounting base, a resilient component and an engaging structure. An accommodating slot is formed on a first end portion of the mounting base. The resilient component is a one-piece structure and detachably and partially accommodated in the accommodating slot. The engaging structure is formed on a second end portion of the mounting base. When the mounting kit is mounted on the rail component, the resilient component is resiliently deformed by the rail component and a wall of the accommodating slot, so as to drive the rail component to engage with the engaging structure along a vertical direction and to abut against a connecting portion of the mounting base for preventing shaking movements of the mounting kit relative to the rail component along the vertical direction and the horizontal direction. Besides, a related rail mounting system is provided.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: August 22, 2023
    Assignee: Moxa Inc.
    Inventor: Min-Heng Yao
  • Patent number: 11473098
    Abstract: A tobacco arsenic transport gene NtNIP7-1 and a cloning method and application thereof are disclosed. A nucleotide sequence of the tobacco arsenic transport gene NtNIP7-1 is shown as SEQ ID: No. 1, and an encoded amino acid sequence thereof is shown as SEQ ID: No. 2. The cloning method of the tobacco arsenic transport gene NtNIP7-1 includes (S1) extracting RNA in tobacco, performing reverse transcription, and obtaining a first-strand cDNA; and (S2) taking the first-strand cDNA obtained by the reverse transcription as a template, synthesizing a specific primer according to sequences of the NtNIP7-1 gene, performing PCR amplification, recovering and purifying a product of the PCR amplification, and sequencing. In the present invention, inhibition of the expression of the tobacco endogenous gene NtNIP7-1 in tobacco plants is able to significantly reduce the arsenic content of tobacco leaves, and has broad application prospects in the field of low arsenic content breeding.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: October 18, 2022
    Assignee: YUNAN ACADEMY OF TOBACCO AGRICULTURE SCIENCE
    Inventors: Ge Bai, Dahai Yang, Tao Pang, He Xie, Yong Li, Heng Yao, Yongping Li, Xuejun Chen, Bingguang Xia, Dunhuang Fang, Yahui Wang, Chunjiang Yang, Chendong Zhang, Xingfu Wu, Jianmin Zeng
  • Publication number: 20220304183
    Abstract: A mounting kit adapted for a rail component is provided and includes a mounting base, a resilient component and an engaging structure. An accommodating slot is formed on a first end portion of the mounting base. The resilient component is a one-piece structure and detachably and partially accommodated in the accommodating slot. The engaging structure is formed on a second end portion of the mounting base. When the mounting kit is mounted on the rail component, the resilient component is resiliently deformed by the rail component and a wall of the accommodating slot, so as to drive the rail component to engage with the engaging structure along a vertical direction and to abut against a connecting portion of the mounting base for preventing shaking movements of the mounting kit relative to the rail component along the vertical direction and the horizontal direction. Besides, a related rail mounting system is provided.
    Type: Application
    Filed: September 30, 2021
    Publication date: September 22, 2022
    Applicant: Moxa Inc.
    Inventor: Min-Heng Yao
  • Patent number: 11374344
    Abstract: A protecting cover includes a latching component and a releasing component. The latching component includes an engaging portion. The engaging portion engages with a cooperating portion of a connecting port when the latching component is at least partially accommodated inside the connecting port. The releasing component is detachably installed on the latching component and includes a resilient arm. The resilient arm abuts against the engaging portion to drive the engaging portion to disengage from the cooperating portion by operation of the resilient arm when the releasing component is installed on the latching component. The latching component at least partially accommodated inside the connecting port covers a front opening of the connecting port, and removal of the latching component requires the releasing component. It not only prevents outside dust particles or substances from entering into the connecting port but also prevents an unauthorized connection of the connecting port.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: June 28, 2022
    Assignee: Moxa Inc.
    Inventors: Min-Heng Yao, Chun-Jen Shih
  • Publication number: 20220149557
    Abstract: A protecting cover includes a latching component and a releasing component. The latching component includes an engaging portion. The engaging portion engages with a cooperating portion of a connecting port when the latching component is at least partially accommodated inside the connecting port. The releasing component is detachably installed on the latching component and includes a resilient arm. The resilient arm abuts against the engaging portion to drive the engaging portion to disengage from the cooperating portion by operation of the resilient arm when the releasing component is installed on the latching component. The latching component at least partially accommodated inside the connecting port covers a front opening of the connecting port, and removal of the latching component requires the releasing component. It not only prevents outside dust particles or substances from entering into the connecting port but also prevents an unauthorized connection of the connecting port.
    Type: Application
    Filed: April 6, 2021
    Publication date: May 12, 2022
    Inventors: Min-Heng Yao, Chun-Jen Shih
  • Publication number: 20220044447
    Abstract: An image processing method including the following steps is provided. An image information of an image is received, wherein the image includes a plurality of blocks and the image information includes a plurality of pixel information of each block. A dual gamma correction is performed on a first group of blocks of the image to obtain one or more corrected blocks and the dual gamma correction is skipped on a second group of blocks of the image to obtain a plurality of uncorrected blocks. A first encoding process is performed on the one or more corrected blocks to obtain a plurality of first encoded blocks. A second encoding process different from the first encoding process is performed on the plurality of uncorrected blocks to obtain a plurality of second encoded blocks.
    Type: Application
    Filed: August 7, 2020
    Publication date: February 10, 2022
    Applicant: Novatek Microelectronics Corp.
    Inventors: Hui-Yu Jiang, Heng-Yao Lin, Yen-Tao Liao
  • Patent number: 11140393
    Abstract: A display device that includes an encoder circuit, a decoder circuit and an overdrive circuit is introduced. The encoder circuit includes a prediction circuit, a quantization circuit, and a bitstream coding circuit. The prediction circuit performs a prediction operation on a first image frame to generate a second image frame. The quantization circuit performs a quantization operation on the second image frame based on a quantization parameter to generated a quantized image frame. The bitstream coding circuit encodes the quantized image frame to generate an encoded bit stream. The quantization parameter is determined according to a grey level of a pixel in the second image frame. The decoder circuit decodes the encoded bit stream to generate a reconstructed image frame. The overdrive circuit generates an overdrive image frame to be displayed on a display panel based on a third image frame and the reconstructed image frame.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: October 5, 2021
    Assignee: Novatek Microelectronics Corp.
    Inventors: Hui-Yu Jiang, Heng-Yao Lin, Yen-Tao Liao
  • Publication number: 20210211522
    Abstract: The present application discloses a mini app processing method, apparatus, device and a storage medium, and relates to the field of cloud computing and mini app processing. The specific implementation scheme includes: receiving a mini app pre-download request sent by a host application, where the mini app pre-download request is generated by the host application based on user browsing data, and at least includes a mini app page open command; parsing the mini app page open command, and obtaining download information required to execute the mini app page open command; and sending the download information to the host application for the host application to perform mini app pre-download.
    Type: Application
    Filed: March 23, 2021
    Publication date: July 8, 2021
    Applicant: Beijing Baidu Netcom Science and Technology Co., LTD
    Inventors: Du Chen, Yuzhen Chen, Zhenxing Cao, Jia Wei, Wei Peng, Heng Yao
  • Patent number: 10790641
    Abstract: A clamping mechanism for a din rail is provided. No external force is continuously applied to a sliding component to maintain the removal state of the clamping mechanism. The clamping mechanism does not require additional tools for recovery of the sliding component. Therefore, the efficiency of providing the clamping mechanism for easy disassembly and assembly on the din rail may be achieved.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: September 29, 2020
    Assignee: Moxa Inc.
    Inventors: Min-Heng Yao, Chung-Kun Hou