Patents by Inventor Heng Yu HUAN

Heng Yu HUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220251432
    Abstract: The present invention provides a curable pressure-sensitive adhesive composition, including a reactive polyacrylate, a liquid epoxy resin, a solid epoxy resin, a hydroxyl-containing compound, and a photoinitiator of specific contents. The curable pressure-sensitive adhesive composition may further include an epoxy silane coupling agent of a specific content. In addition, the present invention further provides a curable pressure-sensitive adhesive tape and a battery pack including the curable pressure-sensitive adhesive composition. The curable pressure-sensitive adhesive composition and the curable pressure-sensitive adhesive tape provided by the present invention have at least good bonding strength and good anti-warping performance, and can improve the stability and safety of battery packs.
    Type: Application
    Filed: May 19, 2020
    Publication date: August 11, 2022
    Inventors: Zhen Qian YANG, Heng Yu HUAN, En Zhong ZHANG, Jie HUANG, Zheng GUAN, Rui PAN