Abstract: A device used for attaching a semiconductor device to a circuit board over a first temperature. The device includes a hook member that includes a first hook, a second hook, and a body between the first hook and the second hook. The body has a first surface, a second surface opposite the first surface, and a first hole extended from the first surface to the second surface. The device further includes a fixing member and a holder. The fixing member has a second hole, and the holder passes through the first hole and the second hole, and is engaged with the fixing member.

Abstract: A device used for attaching a semiconductor device to a circuit board over a first temperature. The device includes a hook member that includes a first hook, a second hook, and a body between the first hook and the second hook. The body has a first surface, a second surface opposite the first surface, and a first hole extended from the first surface to the second surface. The device further includes a fixing member and a holder. The fixing member has a second hole, and the holder passes through the first hole and the second hole, and is engaged with the fixing member.

Abstract: A test assembly for an integrated circuit package includes a package substrate and a test board. The package substrate is provided with a plurality of first contact pads linked in a first daisy chain pattern. The test board has a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads. All of the second contact pads are divided into a plurality of groups each connected to one pair of test pads. All of the second contact pads in any group are arranged in a line. The present invention further provides a method of testing an integrated circuit package utilizing the aforementioned package substrate and test board.

Abstract: A test assembly for an integrated circuit package includes a package substrate and a test board. The package substrate is provided with a plurality of first contact pads linked in a first daisy chain pattern. The test board has a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads. All of the second contact pads are divided into a plurality of groups each connected to one pair of test pads. All of the second contact pads in any group are arranged in a line. The present invention further provides a method of testing an integrated circuit package utilizing the aforementioned package substrate and test board.

Abstract: A test assembly for an integrated circuit package includes a package substrate and a test board. The package substrate is provided with a plurality of first contact pads linked in a first daisy chain pattern. The test board has a plurality of second contact pads linked in a second daisy chain pattern and a plurality of test pads. All of the second contact pads are divided into a plurality of groups each connected to one pair of test pads. All of the second contact pads in any group are arranged in a line. The present invention further provides a method of testing an integrated circuit package utilizing the aforementioned package substrate and test board.