Patents by Inventor Heng-Yu Yen

Heng-Yu Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Motherboard
    Patent number: 9125324
    Abstract: A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: September 1, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Heng-Yu Yen, Pai-Ching Huang
  • Motherboard module and electronic apparatus using the same
    Patent number: 9098256
    Abstract: The disclosure provides a motherboard module, which includes a motherboard, a cover, a plurality of raised posts and a plurality of plates. The cover covers the motherboard thereon and a first space is formed by the cover and the motherboard. The raised posts are disposed in the first space. The plates are detachably assembled to the raised posts and connected between any two adjacent raised posts so as to partition the first space into a plurality of second spaces. The plates and the raised posts can restrict the heat generated by the heat sources at different limited areas, which is advantageous for the cooling air-flow to cool the heat sources and the motherboard module thereby has better cooling performance.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: August 4, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Heng-Yu Yen, Pai-Ching Huang
  • MOTHERBOARD MODULE AND ELECTRONIC APPARATUS USING THE SAME
    Publication number: 20130094140
    Abstract: The disclosure provides a motherboard module, which includes a motherboard, a cover, a plurality of raised posts and a plurality of plates. The cover covers the motherboard thereon and a first space is formed by the cover and the motherboard. The raised posts are disposed in the first space. The plates are detachably assembled to the raised posts and connected between any two adjacent raised posts so as to partition the first space into a plurality of second spaces. The plates and the raised posts can restrict the heat generated by the heat sources at different limited areas, which is advantageous for the cooling air-flow to cool the heat sources and the motherboard module thereby has better cooling performance.
    Type: Application
    Filed: September 5, 2012
    Publication date: April 18, 2013
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Heng-Yu Yen, Pai-Ching Huang
  • MOTHERBOARD
    Publication number: 20120257356
    Abstract: A motherboard includes a circuit board, a plurality of electronic components, a metal cover and a flexible heat-conducting component. The electronic components are disposed at the circuit board. The metal cover covers the circuit board. The flexible heat-conducting component is disposed between the circuit board and the metal cover and contacts the electronic components and the metal cover.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 11, 2012
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Heng-Yu Yen, Pai-Ching Huang