Patents by Inventor Hengda YU

Hengda YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240009343
    Abstract: A medical silicone pressure-sensitive adhesive composition is described that includes: organopolysiloxane A, organopolysiloxane resin B, organopolysiloxane crosslinker XL, organopolysiloxane extender CE, hydrosilylation catalyst D, solvent E and hydrosilylation inhibitor F, wherein the organopolysiloxanes A, CE and XL are chosen such that the molar ratio RHAlk=tH/tAlk is 3.5 to 8; and nHXL/nHCE is within 0.13 to 11, with:—tH=number of moles of hydrogen atom directly bonded to a silicon atom of the organopolysiloxanes XL and CE;—tAlk=number of moles of alkenyl directly bonded to a silicon atom of the organopolysiloxane A;—nHXL=number of moles of hydrogen atom directly bonded to a silicon atom of the organopolysiloxane XL;—nHCE=number of moles of hydrogen atom directly bonded to a silicon atom of the organopolysiloxane CE.
    Type: Application
    Filed: November 3, 2020
    Publication date: January 11, 2024
    Inventors: Hengda YU, Yin ZHANG, Caroline MOINE