Patents by Inventor Hengfei SHI

Hengfei SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot-pressing buffer substrate, display device, hot-pressing process and method for reducing x-line bright line
    Patent number: 10985349
    Abstract: The present disclosure provides a hot-pressing buffer, a display device, a hot-pressing process, and a method for reducing the X-line bright lines. The hot-pressing buffer includes: a thermally conductive material layer including a non-particulate thermally conductive material made of a non-particulate thermally conductive material; and a buffer material layer wrapped around an outer surface of the non-particulate thermally conductive material layer.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: April 20, 2021
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiehong Zhou, Hengfei Shi, Ke Cao
  • HOT-PRESSING BUFFER SUBSTRATE, DISPLAY DEVICE, HOT-PRESSING PROCESS AND METHOD FOR REDUCING X-LINE BRIGHT LINE
    Publication number: 20200185659
    Abstract: The present disclosure provides a hot-pressing buffer, a display device, a hot-pressing process, and a method for reducing the X-line bright lines. The hot-pressing buffer includes: a thermally conductive material layer including a non-particulate thermally conductive material made of a non-particulate thermally conductive material; and a buffer material layer wrapped around an outer surface of the non-particulate thermally conductive material layer.
    Type: Application
    Filed: August 23, 2019
    Publication date: June 11, 2020
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xiehong ZHOU, Hengfei SHI, Ke CAO