Patents by Inventor Hengju Cheng
Hengju Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9787264Abstract: Techniques and mechanisms for providing signal communication with a configurable transceiver circuit. In an embodiment, an integrated circuit comprises transceiver circuitry including an output stage and current mirror circuitry. The output stage is coupled to receive a differential signal pair and to provide at least one output signal based on the differential signal pair. In another embodiment, configuration logic is operable to select between a first mode and a second mode of the transceiver circuit. The first mode includes the current mirror circuitry being disabled from providing a current signal to the output stage, and a first circuit path being closed to provide voltage to the output stage. The second mode includes the first circuit path being open and the current mirror circuitry being enabled to provide a current signal to the output stage.Type: GrantFiled: December 20, 2013Date of Patent: October 10, 2017Assignee: Intel CorporationInventors: Miaobin Gao, Christine M. Krause, Hiu-Chin Wu, Hengju Cheng
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Publication number: 20160301372Abstract: Techniques and mechanisms for providing signal communication with a configurable transceiver circuit. In an embodiment, an integrated circuit comprises transceiver circuitry including an output stage and current mirror circuitry. The output stage is coupled to receive a differential signal pair and to provide at least one output signal based on the differential signal pair. In another embodiment, configuration logic is operable to select between a first mode and a second mode of the transceiver circuit. The first mode includes the current mirror circuitry being disabled from providing a current signal to the output stage, and a first circuit path being closed to provide voltage to the output stage. The second mode includes the first circuit path being open and the current mirror circuitry being enabled to provide a current signal to the output stage.Type: ApplicationFiled: December 20, 2013Publication date: October 13, 2016Inventors: Miaobin GAO, Christine M. KRAUSE, Hiu-Chin Wu, Hengju CHENG
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Patent number: 9250406Abstract: Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.Type: GrantFiled: December 20, 2012Date of Patent: February 2, 2016Assignee: Intel CorporationInventors: Peter L. D. Chang, Edris M. Mohammed, Henning Braunisch, Hengju Cheng
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Patent number: 9252884Abstract: Described herein is an apparatus for improving bandwidth of a transceiver system e.g., a Universal Serial Bus (USB) micro-B connector. The apparatus comprises a first pair of lens units, each lens unit of the pair positioned on either side of an input-output (I/O) bus interface, the pair of lens units to send and receive optical signals respectively; a first housing to shield the first pair of lens units and for physically coupling the I/O bus interface and the first pair of lens units to a receptacle; and a key to grasp the first housing and to lock the first housing with the receptacle.Type: GrantFiled: October 21, 2013Date of Patent: February 2, 2016Assignee: Intel CorporationInventors: Jamyuen Ko, Hengju Cheng
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Patent number: 9239439Abstract: Embodiments of the invention are directed to an optical USB (OUSB) to enhance the data rate of USB by adding super-high data rate (e.g. 10 Gbps) optical communication on top of its current specification so that backward compatibility is achievable. Mechanical tolerances may be achieved by using embedded lenses to expand a beam emerging from the connector prior to entering its mating connector and using an identical lens in the mating connector to collimate the beam back onto a fiber.Type: GrantFiled: October 29, 2013Date of Patent: January 19, 2016Assignee: Intel CorporationInventors: Jamyuen Ko, Hengju Cheng, Tom Mader
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Patent number: 9112601Abstract: Embodiments of the present disclosure provide optical link handshake techniques and configurations. In one embodiment, an optical module includes a laser driver corresponding with a channel of the optical module, a signal detector corresponding with the channel, and a link handshake state machine configured to control the laser driver to generate a connect pulse of a link handshake process to test an optical link between the channel and a corresponding channel of another optical module and monitor the signal detector to detect a connect pulse from the another optical module. Other embodiments may be described and/or claimed.Type: GrantFiled: March 27, 2012Date of Patent: August 18, 2015Assignee: Intel CorporationInventors: Miaobin Gao, Christine M. Krause, Hui-Chin Wu, Hengju Cheng
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Patent number: 9039304Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.Type: GrantFiled: September 18, 2009Date of Patent: May 26, 2015Inventors: Jamyuen Ko, Hengju Cheng, Simon S. Lee
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Patent number: 9011022Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.Type: GrantFiled: December 19, 2013Date of Patent: April 21, 2015Assignee: Intel CorporationInventors: Jamyuen Ko, Hengju Cheng, Simon S. Lee
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Patent number: 8938164Abstract: A system includes two optical modules that perform auto-setting of the optical links between the optical modules. One optical module sends an optical signal with a test pattern to the other optical module. If the receiving module determines that the test pattern is successfully received, it sends a pass indication to the transmitting module, and the transmitting module can configure its driver path in accordance with a transmit current setting used to transmit the test pattern. If the test pattern is not successfully received, the receiving module sends a fail indication, and the transmitting module can increase the transmit current setting and resend the test pattern. When the system includes multiple optical channels, one channel can be tested while feedback is provided on another channel. The system can iterate through all optical channels until they are all configured.Type: GrantFiled: September 28, 2012Date of Patent: January 20, 2015Assignee: Intel CorporationInventors: Miaobin Gao, Christine M. Krause, Hui-Chin Wu, Hengju Cheng
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Patent number: 8913639Abstract: Embodiments of the present disclosure provide laser safety techniques and configurations. In one embodiment, an optical module includes a first die including a laser configured to transmit optical signals, a first node electrically coupled with the laser, and a second node electrically coupled with the laser, and a second die including a power supply line configured to provide power to the laser, a third node electrically coupled with the power supply line and electrically coupled with the first node to provide the power to the laser, a fourth node electrically coupled with the second node of the first die, and a switch configured to prevent the power of the power supply line from reaching the laser through the third node based on a voltage of the fourth node when a laser fault event occurs. Other embodiments may be described and/or claimed.Type: GrantFiled: March 27, 2012Date of Patent: December 16, 2014Assignee: Intel CorporationInventors: Miaobin Gao, Hui-Chin Wu, Christine M. Krause, Hengju Cheng
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Publication number: 20140186046Abstract: Embodiments of the present disclosure provide laser safety techniques and configurations. In one embodiment, an optical module includes a first die including a laser configured to transmit optical signals, a first node electrically coupled with the laser, and a second node electrically coupled with the laser, and a second die including a power supply line configured to provide power to the laser, a third node electrically coupled with the power supply line and electrically coupled with the first node to provide the power to the laser, a fourth node electrically coupled with the second node of the first die, and a switch configured to prevent the power of the power supply line from reaching the laser through the third node based on a voltage of the fourth node when a laser fault event occurs. Other embodiments may be described and/or claimed.Type: ApplicationFiled: March 27, 2012Publication date: July 3, 2014Inventors: Miaobin Gao, Hui-Chin Wu, Christine M. Krause, Hengju Cheng
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Patent number: 8768179Abstract: A power management arrangement for low power optical transceiver such as those that may be integrated into a personal computer or server may periodically put itself into a power conservation or sleep mode which assures the transceiver is available upon wake-up.Type: GrantFiled: March 8, 2012Date of Patent: July 1, 2014Assignee: Intel CorporationInventors: Hui-chin Wu, Miaobin Gao, Hengju Cheng
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Publication number: 20140178009Abstract: A connection port provides electrical and/or optical interface capability. The combined electrical and optical interface port may include an optical communication light engine within the connection port itself. The connection port includes a connector housing, an electrical interface assembly, and an optical interface assembly incorporated together. One implementation of the optical communication light engine includes a laser diode to generate optical signals, a photo diode to receive optical signals, and an optical integrated circuit (IC) to control optical interface.Type: ApplicationFiled: December 19, 2013Publication date: June 26, 2014Inventors: Jamyuen Ko, Hengju Cheng, Simon S. Lee
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Publication number: 20140177625Abstract: Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 20, 2012Publication date: June 26, 2014Inventors: Peter L.D. Chang, Edris M. Mohammed, Henning Braunisch, Hengju Cheng
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Publication number: 20140133846Abstract: Embodiments of the present disclosure provide optical link handshake techniques and configurations. In one embodiment, an optical module includes a laser driver corresponding with a channel of the optical module, a signal detector corresponding with the channel, and a link handshake state machine configured to control the laser driver to generate a connect pulse of a link handshake process to test an optical link between the channel and a corresponding channel of another optical module and monitor the signal detector to detect a connect pulse from the another optical module. Other embodiments may be described and/or claimed.Type: ApplicationFiled: March 27, 2012Publication date: May 15, 2014Inventors: Miaobin Gao, Christine M. Krause, Hui-Chin Wu, Hengju Cheng
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Publication number: 20140133811Abstract: Embodiments of the invention are directed to an optical USB (OUSB) to enhance the data rate of USB by adding super-high data rate (e.g. 10 Gbps) optical communication on top of its current specification so that backward compatibility is achievable. Mechanical tolerances may be achieved by using embedded lenses to expand a beam emerging from the connector prior to entering its mating connector and using an identical lens in the mating connector to collimate the beam back onto a fiber.Type: ApplicationFiled: October 29, 2013Publication date: May 15, 2014Inventors: Jamyuen Ko, Hengju Cheng, Tom Mader
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Publication number: 20140093233Abstract: A system includes two optical modules that perform auto-setting of the optical links between the optical modules. One optical module sends an optical signal with a test pattern to the other optical module. If the receiving module determines that the test pattern is successfully received, it sends a pass indication to the transmitting module, and the transmitting module can configure its driver path in accordance with a transmit current setting used to transmit the test pattern. If the test pattern is not successfully received, the receiving module sends a fail indication, and the transmitting module can increase the transmit current setting and resend the test pattern. When the system includes multiple optical channels, one channel can be tested while feedback is provided on another channel. The system can iterate through all optical channels until they are all configured.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Inventors: Miaobin Gao, Christine M. Krause, Hui-Chin Wu, Hengju Cheng
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Publication number: 20140050491Abstract: Described herein is an apparatus for improving bandwidth of a transceiver system e.g., a Universal Serial Bus (USB) micro-B connector. The apparatus comprises a first pair of lens units, each lens unit of the pair positioned on either side of an input-output (I/O) bus interface, the pair of lens units to send and receive optical signals respectively; a first housing to shield the first pair of lens units and for physically coupling the I/O bus interface and the first pair of lens units to a receptacle; and a key to grasp the first housing and to lock the first housing with the receptacle.Type: ApplicationFiled: October 21, 2013Publication date: February 20, 2014Inventors: Jamyuen KO, Hengju CHENG
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Patent number: 8613561Abstract: Embodiments of the invention are directed to an optical USB (OUSB) to enhance the data rate of USB by adding super-high data rate (e.g. 10 Gbps) optical communication on top of its current specification so that backward compatibility is achievable. Mechanical tolerances may be achieved by using embedded lenses to expand a beam emerging from the connector prior to entering its mating connector and using an identical lens in the mating connector to collimate the beam back onto a fiber.Type: GrantFiled: February 4, 2013Date of Patent: December 24, 2013Assignee: Intel CorporationInventors: Jamyuen Ko, Hengju Cheng, Tom Mader
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Patent number: 8571413Abstract: Described herein is an apparatus for improving bandwidth of a transceiver system e.g., a Universal Serial Bus (USB) micro-B connector. The apparatus comprises a first pair of lens units, each lens unit of the pair positioned on either side of an input-output (I/O) bus interface, the pair of lens units to send and receive optical signals respectively; a first housing to shield the first pair of lens units and for physically coupling the I/O bus interface and the first pair of lens units to a receptacle; and a key to grasp the first housing and to lock the first housing with the receptacle.Type: GrantFiled: September 24, 2010Date of Patent: October 29, 2013Assignee: Intel CorporationInventors: Jamyuen Ko, Hengju Cheng