Abstract: The present application discloses a cutting apparatus, including: a housing; a door; and a gas cleaning device configured to receive a cleaning gas through the gas inlet and blow the cleaning gas out of the at least one primary gas outlet towards the door to clean the door. The present application uses a gas cleaning device to clean the door, and a gas curtain formed by cleaning gas causes a cutting coolant, chips and sand particles, etc. attached to the cutting door to drip down to a baffle and then return to an operating cavity. Moreover, by controlling the blow-out angle and pressure of the cleaning gas, the cutting coolant, chips and sand particles, etc. can be retained within the range of the operating cavity without dripping onto the outside of the cutting apparatus.

Abstract: Vacuum systems for epoxy mounting of material samples are disclosed. In some examples, a vacuum system may be a castable and/or cold mounting vacuum system that facilitates mounting and/or encapsulation of material samples in epoxy resin under low, vacuum, and/or near vacuum pressure. In some examples, the vacuum system may comprise a flow control device configured to control epoxy flow through a dispensing tube that connects to a hollow vacuum chamber. In some examples, the vacuum chamber may have an opening encircled by a rim sandwiched between upper and lower portions of a sealing ring. A movable lid may be configured to press down on the upper portion of the sealing ring when in a closed position, so as to seal the opening.

Abstract: Systems and methods for mounting of material samples via a vacuum system and controlling fluid flow through a tube of the vacuum system are disclosed. In some examples, the vacuum system may be a castable and/or cold mounting vacuum system that facilitates mounting and/or encapsulation of material samples in epoxy resin under low, vacuum, and/or near vacuum pressure. In some examples, the vacuum system may comprise a flow control device configured to control epoxy flow through a dispensing tube that connects to a hollow vacuum chamber. In some examples, the vacuum chamber may have an opening defined by a rim sandwiched between upper and lower portions of a sealing ring. A movable lid may be configured to press down on the upper portion of the sealing ring when in a closed position, so as to seal the opening.

Abstract: Vacuum systems for epoxy mounting of material samples are disclosed. In some examples, a vacuum system may be a castable and/or cold mounting vacuum system that facilitates mounting and/or encapsulation of material samples in epoxy resin under low, vacuum, and/or near vacuum pressure. In some examples, the vacuum system may comprise a flow control device configured to control epoxy flow through a dispensing tube that connects to a hollow vacuum chamber. In some examples, the vacuum chamber may have an opening encircled by a rim sandwiched between upper and lower portions of a sealing ring. A movable lid may be configured to press down on the upper portion of the sealing ring when in a closed position, so as to seal the opening.

Abstract: Systems and methods for mounting of material samples via a vacuum system and controlling fluid flow through a tube of the vacuum system are disclosed. In some examples, the vacuum system may be a castable and/or cold mounting vacuum system that facilitates mounting and/or encapsulation of material samples in epoxy resin under low, vacuum, and/or near vacuum pressure. In some examples, the vacuum system may comprise a flow control device configured to control epoxy flow through a dispensing tube that connects to a hollow vacuum chamber. In some examples, the vacuum chamber may have an opening defined by a rim sandwiched between upper and lower portions of a sealing ring. A movable lid may be configured to press down on the upper portion of the sealing ring when in a closed position, so as to seal the opening.