Patents by Inventor Heng Yun Zhang

Heng Yun Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6873527
    Abstract: The invention relates to heat transfer apparatus for cooling electronic components. There is a continuously increasing demand for compact electronic systems such as portable laptop computers and thirst for high processing power, leading to high heat generated by components residing within these systems. These electronic systems have to be cooled due to their fixed operating temperature ranges. Operating an electronic component beyond its rated operating temperature range will damage electronic components. Instead of conventionally utilising a bigger fan, a smaller sized solution is required for cooling an electronic component contained in a compact electronic system, for example a notebook computer. A heat transfer apparatus includes a heat carrier for conveying heat away from the electronic system into a radiator for dissipation. The radiator is placed into a cooler for directing air through the radiator and expelling heated air, cooling the radiator in the process.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: March 29, 2005
    Inventors: Heng Yun Zhang, Damaruganath Pinjala, Hidetaka Hayashi, Poh Keong Chan
  • Publication number: 20040012925
    Abstract: The invention relates to heat transfer apparatus for cooling electronic components. There is a continuously increasing demand for compact electronic systems such as portable laptop computers and thirst for high processing power, leading to high heat generated by components residing within these systems. These electronic systems have to be cooled due to their fixed operating temperature ranges. Operating an electronic component beyond its rated operating temperature range will damage electronic components. Instead of conventionally utilising a bigger fan, a smaller sized solution is required for cooling an electronic component contained in a compact electronic system, for example a notebook computer. A heat transfer apparatus includes a heat carrier for conveying heat away from the electronic system into a radiator for dissipation. The radiator is placed into a cooler for directing air through the radiator and expelling heated air, cooling the radiator in the process.
    Type: Application
    Filed: May 28, 2003
    Publication date: January 22, 2004
    Inventors: Heng Yun Zhang, Damaruganath Pinjala, Hidetaka Hayashi, Poh Keong Chan