Patents by Inventor Hengzhen Li

Hengzhen Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11930587
    Abstract: Provided are a flexible printed circuit board and a display device. The flexible printed circuit board comprises a main flexible printed circuit board and a connection flexible printed circuit board having different outlines. Both printed circuit boards are single-layer boards or double-layer boards. The main flexible printed circuit board comprises a bonding region, a device mounting region, a first connection region and signal lines. The signal lines include a first signal line positioned between the device mounting region and the first connection region, and a second signal line positioned between the device mounting region and the bonding region. The connection flexible printed circuit board comprises a second connection region, a third connection region and a third signal line positioned between the second connection region and the third connection region. The two flexible printed circuit boards are connected by means of the first connection region and the second connection region.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: March 12, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Fan Li, Hengzhen Liang, Yunhan Xiao, Lianbin Liu
  • Patent number: 11921550
    Abstract: A circuit board, a display panel and a display apparatus are provided. The circuit board includes a main circuit board and an adapter circuit board stacked on the main circuit board. The adapter circuit board is provided with at least one first pad region, and the first pad region includes a hollowed region penetrating through the adapter circuit board and multiple first pads distributed around the hollowed region. The main circuit board is provided with at least one second pad region including multiple second pads, and the first pads of each of the first pad regions are respectively soldered to the multiple second pads of a corresponding second pad region.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: March 5, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Fan Li, Qiang Tang, Lianbin Liu, Yunhan Xiao, Xiaolong Zhu, Hengzhen Liang
  • Publication number: 20150041392
    Abstract: Provided is a method using micro/nano bubbles for enhanced in situ remediation of polluted groundwater, comprising: arranging a water injection pipe (7) at an upstream location of an area where groundwater is polluted; introducing thereto a micro/nano bubbles-containing water having nutrient salt(s) therein; transferring the micro/nano bubbles-containing water having nutrient salt(s) with the movement of groundwater to the polluted area, decomposing organic pollutants or continuously replenishing electron acceptor(s)/donor(s) for microorganisms to facilitate the degradation and removal of the organic pollutants; meanwhile, arranging a water extraction pipe (17) at the downstream of the polluted area to extract water and form a groundwater flow-field; setting up a monitoring well for real-time monitoring and analyzing of parameters during the removal process of the organic pollutants and adjusting the occurrence time and the amount of aeration of the micro/nano bubbles.
    Type: Application
    Filed: January 21, 2013
    Publication date: February 12, 2015
    Inventors: Liming Hu, Dejun Song, Hengzhen Li