Patents by Inventor Henju Cheng

Henju Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board construction for use in small form factor fiber optic communication system transponders
    Patent number: 6903934
    Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features separate transmitter and receiver ports and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A Flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board using ball grid arrays having overlapping attachment structures.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: June 7, 2005
    Assignee: Stratos International, Inc.
    Inventors: WeiZen Lo, Henju Cheng, William Wang
  • Circuit board construction for use in small form factor fiber optic communication system transponders
    Publication number: 20040047570
    Abstract: A transponder assembly for use with fiber optic digital communication cables having multiple parallel optic fiber elements. The transponder assembly features separate transmitter port and receiver ports and an electrical connector for connecting with computer or communication systems. The transponder assembly includes a parallel optic transmitter module and a parallel optic receiver module. The assembly also includes a circuit board on which a semiconductor chip useful for signal processing and the electrical connector are mounted. A Flex circuit is used in connecting the circuit board to the parallel optic modules. The semiconductor chip and electrical connector are mounted directly across from one another on opposite surfaces of the circuit board using ball grid arrays having overlapping attachment structures.
    Type: Application
    Filed: September 6, 2002
    Publication date: March 11, 2004
    Applicant: PARACER, INC.
    Inventors: WeiZen Lo, Henju Cheng, William Wang