Patents by Inventor Henk Thoonen

Henk Thoonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical shielding in stacked dies by using conductive die attach adhesive
    Patent number: 8076763
    Abstract: In example embodiment, there is an integrated circuit (IC) device (5) assembled in a package (5) having a plurality of die including a first device (20) and at least one additional device (30). The IC comprises a substrate (10). A first device die (20), having bonding pads including ground connections, is die attached to the substrate (10). An additional device die (30), having bonding pads including ground connections is disposed on top of the first device die (20). The additional device die is die attached to the first device die. The ground connections of the first device die are connected to the ground connections of the additional device die in order to minimize the electrical interference between the device dies. An additional feature of the embodiment is, ground connections of the first device are connected to the ground connections of the additional device with a conductive adhesive (25).
    Type: Grant
    Filed: October 1, 2004
    Date of Patent: December 13, 2011
    Assignee: NXP B.V.
    Inventor: Henk Thoonen
  • Electrical Shielding in Stacked Dies by Using Conductive Die Dttach Adhesive
    Publication number: 20080315432
    Abstract: In example embodiment, there is an integrated circuit (IC) device (5) assembled in a package (5) having a plurality of die including a first device (20) and at least one additional device (30). The IC comprises a substrate (10). A first device die (20), having bonding pads including ground connections, is die attached to the substrate (10). An additional device die (30), having bonding pads including ground connections is disposed on top of the first device die (20). The additional device die is die attached to the first device die. The ground connections of the first device die are connected to the ground connections of the additional device die in order to minimize the electrical interference between the device dies. An additional feature of the embodiment is, ground connections of the first device are connected to the ground connections of the additional device with a conductive adhesive (25).
    Type: Application
    Filed: October 1, 2004
    Publication date: December 25, 2008
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventor: Henk Thoonen