Abstract: Integrated circuit (IC) protections that prevent exposure or examination of integrated circuitry through backside analysis include a layer or mesh of an electrically conductive, electromagnetic radiation blocking material disposed over a backside of an IC device to prevent backside analysis. An electrically conductive conduit couples the material to a node of the integrated circuitry to provide a signal and/or voltage reference to the node through the layer/mesh. If the layer/mesh is tampered with, the integrated circuitry loses the voltage reference or signal thereby disabling the integrated circuitry. The IC device may include detection circuitry to monitor the node and to generate an alert and/or disable the circuitry upon tampering. The IC device may further include a support substrate, where a substrate between the material/mesh and the integrated circuitry is sufficiently thin that the IC device would be mechanically weak if the support substrate were removed.

Abstract: A foldup food holder made of stiff paperboard provides a base panel; a first side panel; a second side panel; a first end panel; a second end panel; a first tab; and a second tab; the side panels joined with the base panel; the end panels joined contiguously with and extensive from the side panels. The tabs are extensive from and joined contiguously with the end panels so that the tabs are positioned for engaging slots in the side panels when the apparatus is folded into a food holder or container.