Abstract: A printed circuit board provided for mixed-component assembly of electrically hard-wired and surface-mounted components which eliminates the difficulties of bonding large components and which alleviates thermal shock and stress during the soldering of the contacts by a flow bath process. The printed circuit boards for mixed-component assembly are capable of utilizing PLCC components which, in many cases, are difficult to mount on a printed circuit board. The printed circuit board includes at least one recess for receiving and holding a PLCC component. The sides of the recess are provided with conductive indentations which serve to guide the PLCC component during insertion and which provide soldering points for electrical connections.