Abstract: An apparatus for wafer inspection includes an incident-light illumination device having an illumination axis, and an imaging device having an imaging axis. The illumination and imaging axes are inclined with respect to each other and directed onto a region to be inspected of the surface of a wafer. The illumination and imaging axes define an image plane spanned by the illumination and imaging axes in a bright-field illumination setting of the apparatus. The illumination axis is rotatable out of the image plane to a dark-field angle so as to provide a dark-field illumination in the region to be inspected.

Abstract: A system for the detection of macrodefects is disclosed, the system being surrounded by a housing (50) and being subdivided into a first segment (6), a second segment (8), and a third segment (10). Provided in the second segment (8) is a stage (2), displaceable in the X direction and Y direction, on which a wafer (25) is placed. Located in the first segment (6) is an aspiration device (36) that directs aspirated air via an air guide (37) into the second segment (8), the air guide (37) encompassing several air-directing panels (38) so that an air flow (60) is guided in parallel fashion over the wafer (25).

Abstract: The invention concerns an apparatus for inspection of a wafer, encompassing at least two incident-light illumination devices that radiate a respective illuminating light beam which is incident obliquely onto the surface of a wafer to be inspected and respectively defines an illumination axis, an image capture device for capturing an image of the surface in a dark-field arrangement, and a wafer receiving device for receiving the wafer, on whose surface linearly extending features are configured, in a definable orientation. The apparatus is characterized in that the illumination axes are oriented perpendicular to one another, and the apparatus is designed in such a way that a projection of the respective illumination axis onto the surface of the wafer is oriented substantially perpendicular to respective linear features on the surface of the wafer. With the apparatus, macrodefects can be detected and the quality of the edge profile of features configured on the surface of the wafer can be assessed.

Abstract: The invention concerns an apparatus for inspection of a wafer, encompassing at least one incident-light illumination device that radiates an illuminating light beam which is incident obliquely onto a surface of a wafer to be inspected, and an image capture device for capturing an image of the surface in a dark-field arrangement. The wafer inspection apparatus is characterized in that at least one deflection device is provided in order to deflect an associated illuminating light beam onto the surface of the wafer.

Abstract: The invention concerns an apparatus for inspection of a wafer, encompassing at least one illumination device in order to radiate an illuminating light beam onto a surface of the wafer, and an image capture device in order to capture an image of an illuminated region on the surface of the wafer in a plurality of spectral regions, a color modification device being provided in order to modify the color spectrum of the illuminating light beam or of the reflected light beam. The wafer inspection apparatus is characterized in that the color modification device is designed in such a way that the color spectrum of the illuminating light beam, or that of the image that is acquired of the surface of the wafer, is adaptable to the spectral sensitivity of the image capture device.

Abstract: An apparatus for wafer inspection is described, comprising an incident-light illumination device (5) having an illumination axis and an imaging device (9) having an image axis, both of which are inclined with respect to one another and are directed onto a region to be inspected of the surface (42) of a wafer (2). According to the present invention, the apparatus is characterized in that the incident-light illumination device (5) and the imaging device (9, 19) each have associated with them a polarizing means whose transmission axes are oriented at a predetermined angle to one another.

Abstract: An optical transceiver apparatus is provided having a housing including a diode package aligned with a lens and having an optical filler composition injected therebetween. The optical filler composition comprises a silicone elastomer which may be used as an index matching element, as a positioning and locking means, or an optical attenuator.

Abstract: An optoelectronic transceiver having a small footprint and including a laser diode package contained within a subassembly mounted within a housing of the transceiver. The housing includes latches for retaining subassemblies therein. Subassemblies include first apertures for receiving mounting pins to lock the subassemblies within the housing. Plug latch members are mounted onto the subassemblies. Optical transmitter and receiver circuits and one row of nine contacts are mounted to a printed circuit board mounted within the housing of the transceiver.