Abstract: A metal-coated film can be produced continuously from a non-conducting film by successive electroless and galvanic metallization in such a way that a film of this kind is subjected, in a continuous "roll-to-roll" process, to the following operations:a) applying a metallizable primer,b) drying the applied primer,c) conditioning the applied primer,d) optionally activating the applied primer,e) treatment with an electroless chemical metallizing bath,f) optional treatment with a first rinsing liquid,g) treatment with a galvanic metallizing bath,h) treatment with a second rinsing liquid, andi) optional heat treatment of the metallized film.

Abstract: Electrolessly deposited metal films having improved adhesion can be obtained by coating the surface of the substrates to be metallized with a formulation consisting of UV-curable varnishes which contain noble metal compounds as activators and, in addition, either fillers or solvents or a combination of fillers and solvents, curing these varnishes by means of UV radiation, followed by electroless metallization of the substrates thus treated.

Abstract: Electrically conductive patterns, printed-circuit boards for example, with integrated free-standing connection and plugging sections are obtained by the known (semi-)additive methods wherein both the circuit paths and the connection and plugging sections are metallized in one operation with the metal coating in those sections being deposited with such a low adhesion that it can easily be loosened from the surface of the substrate without damage.

Abstract: Injection-moulded printed circuit boards which have been obtained by injection-moulding thermoplastic materials onto the back of flexible circuits are of a particularly high quality if the conductor tracks have been produced on the flexible carriers employed by direct additive or semiadditive metallisation.

Abstract: Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization.The metal coatings produced are distinguished by good adhesion.

Abstract: Formulations containing an organometallic activator, a filler, a special mixture of organic solvents and a PU elastomer are eminently suitable for activating plastic surfaces for their electroless metallization avoiding stress-corrosion cracking.The plastic parts so activated are preferably used for screening from electromagnetic waves after metallization has been carried out.

Abstract: To produce mouldings for screening against electromagnetic radiation it is highly advantageous to use metal fibre-containing composite materials as obtained by impregnating a bundle of continuous metal filament fibres with a polymeric adhesion-promoting substance, sheathing the resulting compact precursor with a thermoplastic matrix and cutting the resulting extrudate of composite material into defined lengths.The composite materials can be used as such or together with thermoplastic granules.

Abstract: To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.

Abstract: Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization.The metal deposits produced are notable for good bond strength.

Abstract: A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.

Abstract: A process suitable for the fully additive technique for the electroless partial metallization of substrate surfaces consists in treating the surface with photosensitive silver(I) compounds (e.g. carboxylic acid salts), partially exposing the silver(I) compounds left behind on the surfaces, if necessary intensifying the exposure effect and/or exchanging the silver produced during the exposure for nobler metals, and detaching the unexposed silver(I) compounds.

Abstract: Black-metallized substrate surfaces which are characterized by the fact that they reflect at most 20% of electromagnetic radiation within the wavelength range from 200 to 5,000 nm and at least 50% within the wavelength range from 7,000 to 24,000 nm, the percentages being relative to the mean value over the entire wavelength range in each case, and which can be used as sunlight collectors are obtained by metallizing activated substrate surfaces without current in metallizing baths which contain a polymeric surface-active compound.

Abstract: A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.

Abstract: A fabric reinforced composite having increased bond strength between impregnating resin and polyaramide reinforcing fabric and method for making the composite including using metal coated polyaramide fabric as the reinforcing material. The metal is deposited by a non-electrical method.

Abstract: Complex compounds of elements of sub-groups 1 and 8 of the periodic table in oxidation stages 1-4 with unsaturated ketones of the formula ##STR1## wherein R.sub.1 and R.sub.4 denote alkyl, cycloalkyl or aryl andR.sub.2 and R.sub.3 denote hydrogen or alkyl, are outstandingly suitable for activating substrate surfaces for electroless metallization since these complexes are distinguished by a high storage stability. The palladium complexes of but-3-en-2-one and hept-3-en-2-one are preferred.

Abstract: Metallized, particularly nickel-coated, knitted net fabrics are suitable for protecting the eyes against microwave radiation with very little adverse effect upon the field of vision, particularly when the mesh width of the knitted net fabrics amounts to <0.25 .lambda., preferably <0.1 .lambda., .lambda. being the wavelength of the radiation to be screened off at the upper frequency limit.

Abstract: A gentle and inexpensive process for activating surfaces for electroless metallization comprises wetting the surfaces with an activating solution containing a silver-I compound which is sparingly soluble in water (for example AgCl) and which has been converted into a soluble form with the aid of complexing agents (for example NH.sub.3), splitting the soluble complex compound back into the sparingly soluble compound and reducing the silver-I compound remaining on the surface.

Abstract: The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.

Abstract: Black-metallized substrate surfaces which are characterized by the fact that they reflect at most 20% of electromagnetic radiation within the wavelength range from 200 to 5,000 nm and at least 50% within the wavelength range from 7,000 to 24,000 nm, the percentages being relative to the mean value over the entire wavelength range in each case, and which can be used as sunlight collectors are obtained by metallizing activated substrate surfaces without current in metallizing baths which contain a polymeric surface-active compound.

Abstract: A carbon fibre or aramid fibre fabric in a matrix of thermoset plastic is coated first with a thin layer of nickel, then with a highly conductive second layer, and on the outside once more with nickel. If the metals are deposited under wet-chemical currentless conditions, the flexible fabric will be electrically highly conductive. The composite material is particularly suitable for lightning and NEMP protection.