Abstract: A positioning system for electrical components to be mounted on a carrier includes establishing a first reference system and bringing the carrier on which the components are to be mounted to a predetermined position in relation to the first system. The locations for the articles to be mounted on the carrier are defined. A second reference system is established with respect to the first reference system and the carrier is positioned in relation to the articles to be mounted on the carrier using the second reference system. Each reference system is defined by at least three fixed points against which the carrier comes to bear and the points of the second reference system duplicate the points of the first reference system so that the carrier is in the exact position to enable the components to be mounted at the exact predetermined location.

Abstract: The invention relates to a method and apparatus which is intended to equip a support substrate with integrated circuit devices of different kinds mounted originally on films. The apparatus includes a machine having cutting heads each associated with the film, and soldering heads. The substrate is mounted on a plate which is movable on a table in a direction perpendicular to the movement of the table, which movement takes place on a threaded spindle drive by a motor. The operation of the machine is monitored and controlled by a unit such as a computer. The invention is applicable in particular to mounting such devices on substrates intended for data-processing assemblies.

Abstract: The invention relates to a method and apparatus which is intended to equip a support substrate with integrated circuit devices of different kinds mounted originally on films. The apparatus includes a machine having cutting heads each associated with the film, and soldering heads. The substrate is mounted on a plate which is movable on a table in a direction perpendicular to the movement of the table, which movement takes place on a threaded spindle drive by a motor. The operation of the machine is monitored and controlled by a unit such as a computer. The invention is applicable in particular to mounting such devices on substrates intended for data-processing assemblies.

Abstract: Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support.

Abstract: An apparatus for accurately positioning a flexible strip, having lateral perforations, with respect to an image. The apparatus includes two supports, a stud member attached to the movable support and an intercepting arm attached to the fixed support. The stud member includes a working section for engagement of the lateral perforation and alignment of the strip and a biased sleeve for position maintenance of the strip. The intercepting arm stays action of the sleeve until alignment is substantially achieved.