Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching laterally-spaced slots in a spacer plate, attaching a thin dielectric sheet over the etched spacer plate, and bonding the etched spacer plate to a transparent substrate such that each channel is formed by the portion of the substrate between flanking walls formed by the etched slots in the spacer plate, adjacent flanking walls in the spacer plate, and the overlying portion of the thin dielectric sheet. In a modification, strengthening crossbars are formed between adjacent flanking walls.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching laterally-spaced slots in a spacer plate, attaching a thin dielectric sheet over the etched spacer plate, and bonding the etched spacer plate to a transparent substrate such that each channel is formed by the portion of the substrate between flanking walls formed by the etched slots in the spacer plate, adjacent flanking walls in the spacer plate, and the overlying portion of the thin dielectric sheet. By positioning the flanking walls between channel electrode pairs, thus providing glass-to-glass interfaces, anodic bonding can be employed to assemble the three channel elements. Etching can be simplified by pre-attaching the unetched channel plate to the substrate or thin dielectric cover sheet with an intervening etch stop, and etching in situ using the-etch stop to prevent etching of the substrate or thin dielectric cover sheet.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching laterally-spaced slots in a spacer plate, attaching a thin dielectric sheet over the etched spacer plate, and bonding the etched spacer plate to a transparent substrate such that each channel is formed by the portion of the substrate between flanking walls formed by the etched slots in the spacer plate, adjacent flanking walls in the spacer plate, and the overlying portion of the thin dielectric sheet. In a modification, strengthening crossbars are formed between adjacent flanking walls.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching laterally-spaced slots in a spacer plate, attaching a thin dielectric sheet over the etched spacer plate, and bonding the etched spacer plate to a transparent substrate such that each channel is formed by the portion of the substrate between flanking walls formed by the etched slots in the spacer plate, adjacent flanking walls in the spacer plate, and the overlying portion of the thin dielectric sheet. In a modification, strengthening crossbars are formed between adjacent flanking walls.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching laterally-spaced slots in a spacer plate, attaching a thin dielectric sheet over the etched spacer plate, and bonding the etched spacer plate to a transparent substrate such that each channel is formed by the portion of the substrate between flanking walls formed by the etched slots in the spacer plate, adjacent flanking walls in the spacer plate, and the overlying portion of the thin dielectric sheet. By positioning the flanking walls between channel electrode pairs, thus providing glass-to-glass interfaces, anodic bonding can be employed to assemble the three channel elements. Etching can be simplified by pre-attaching the unetched channel plate to the substrate or thin dielectric cover sheet with an intervening etch stop, and etching in situ using the etch stop to prevent etching of the substrate or thin dielectric cover sheet.

Abstract: An electronic array of data elements, in particular, a flat display device preferably of the PALC type in which the plasma channels are defined by walls of an organic material, preferably a polyimide material. A protective layer is provided over the polyimide walls to prevent deterioration. Spaced electrode portions are preferably provided on facing surfaces of the walls. The preferred method is to lay down a thick layer of polyimide material and a thin resist over the polyimide layer, pattern the resist, and then use the resist to pattern the polyimide layer in the shape of the desired walls. The walls are then covered with a thin dielectric sheet-like member to form the plasma channels.

Abstract: A flat display device preferably of the PALC type in which the plasma channels are formed by depositing successive layers of electrically conductive and electrically insulating material on a substrate containing spaced walls of a resist material that are preferably structured with a negative slope to form in the space between the resist walls flanking channel walls comprising an electrode layer and rising above it a wall of insulating material with the electrode layer sides exposed to adjacent channels. Subsequently, the resist walls are removed by a lift-off process removing with it the layer deposits on the resist walls leaving behind the layer deposits between the resist walls. The remaining insulating walls are then covered with thin dielectric sheet-like member to form the plasma channels.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching in a substrate laterally-spaced channels and bonding a thin dielectric sheet over the etched substrate. Adjoining each of the channels are shallow ledges, also formed by etching, which serve as recessed areas to receive enlarged ends serving as contact pads for each of the electrodes. Holes are formed in the thin dielectric sheet and contact material deposited on the bonded thin dielectric sheet such that the deposited material makes electrical contact with the underlying electrode contact pads and seals off the holes, which allows a plasma-forming atmosphere to be provided in the channels. This arrangement results in a glass-to-glass interface between the substrate and the thin dielectric sheet, which allows anodic bonding to be employed to assemble the two elements and thus eliminates the frit glass sealing process required in other constructions.

Abstract: A flat display device preferably of the PALC type in which the plasma channels are defined by walls of an organic material, preferably a polyimide material. A protective layer is provided over the polyimide walls to prevent deterioration. Spaced electrode portions are preferably provided on facing surfaces of the walls. The preferred method is to lay down a thick layer of polyimide material and a thin resist over the polyimide layer, pattern the resist, and then use the resist to pattern the polyimide layer in the shape of the desired walls. The walls are then covered with a thin dielectric sheet-like member to form the plasma channels.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching laterally-spaced slots in a spacer plate, attaching a thin dielectric sheet over the etched spacer plate, and bonding the etched spacer plate to a transparent substrate such that each channel is formed by the portion of the substrate between flanking walls formed by the etched slots in the spacer plate, adjacent flanking walls in the spacer plate, and the overlying portion of the thin dielectric sheet. By positioning the flanking walls between channel electrode pairs, thus providing glass-to-glass interfaces, anodic bonding can be employed to assemble the three channel elements. Etching can be simplified by pre-attaching the unetched channel plate to the substrate or thin dielectric cover sheet with an intervening etch stop, and etching in situ using the etch stop to prevent etching of the substrate or thin dielectric cover sheet.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching in a substrate laterally-spaced channels and bonding a thin dielectric sheet over the etched substrate. Adjoining each of the channels are shallow ledges, also formed by etching, which serve as recessed areas to receive enlarged ends serving as contact pads for each of the electrodes. Holes are formed in the thin dielectric sheet and contact material deposited on the bonded thin dielectric sheet such that the deposited material makes electrical contact with the underlying electrode contact pads and seals off the holes, which allows a plasma-forming atmosphere to be provided in the channels. This arrangement results in a glass-to-glass interface between the substrate and the thin dielectric sheet, which allows anodic bonding to be employed to assemble the two elements and thus eliminates the frit glass sealing process required in other constructions.

Abstract: A flat display device preferably of the PALC type in which a fragile micro-sheet covering the plasma channels is replaced by a more robust plate having etched spaced elongated cavities configured in such a way that the top portions of the plate between side walls of each cavity defining a channel and facing the bottom plate are substantially flat. Preferably, the thickness of the glass top plate separating each plasma discharge from an electro-optic pixel is made substantially uniformly thin while the side walls reinforce and greatly increase the strength of the plate making it less prone to breakage during assembly of a display panel. Preferably, the glass plate is etched by means of a plasma etching process.

Abstract: A method for making an electrical device such as a PALC display device, and the electrical device or PALC device so made, in which a channel plate is provided with substantially vertical side walls, and the electrodes are formed by a self-aligning anisotropic plasma etching process which requires no photolithography. A similar process may be used to form a fanout region for individual contacting of channel electrodes. For improved contacting, preferably the fanout region is also channelled and an upstanding structure such as columns provided in the fanout channels so that the spaces between the columns and between the columns and the side walls are filled up with deposited metal that remains following the anisotropic etching process.