Patents by Inventor Henricus A.C. Deeben

Henricus A.C. Deeben has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Synthetic resin capping layer on a printed circuit
    Patent number: 6665192
    Abstract: A printed circuit is provided with a synthetic resin capping layer that exhibits a continuous variation of mechanical properties in a direction at right angles to its surface. The printed circuit can be in a mobile telephone or other portable device, and the capping layer of the printed circuit can optionally constitute the housing of the device.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: December 16, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Reinhold Wimberger Friedl, Egbert Broeksema, Henricus A.C. Deeben