Patents by Inventor Henricus Antonius Lambertus Van Lieverloo

Henricus Antonius Lambertus Van Lieverloo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit provided with overvoltage protection and method for manufacture thereof
    Publication number: 20030213996
    Abstract: The invention concerns an integrated circuit, comprising a substrate (SBSTR) with sub-circuits provided with a number of terminals, including a substrate terminal or earthing point (GND), a Vcc power supply terminal, an input point (in) and an output point (out). At least one of the Vcc power supply terminal, the input point or the output point is connected via an overvoltage protection circuit to the substrate terminal or earthing point, wherein the overvoltage protection circuit comprises means with diode action formed in the substrate between the relevant terminal and the substrate terminal or earthing point. The means comprise two or more diode elements of the Zener type connected in series. The substrate of a first conductivity type is provided with a well (WLL) of a second, opposed conductivity type formed in the substrate.
    Type: Application
    Filed: January 17, 2003
    Publication date: November 20, 2003
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
    Inventor: Henricus Antonius Lambertus Van Lieverloo
  • Integrated circuit provided with overvoltage protection and method for manufacture thereof
    Patent number: 6531744
    Abstract: The invention concerns an integrated circuit, including a substrate (SBSTR) with sub-circuits provided with a number of terminals, including a substrate terminal or earthing point (GND), a Vcc power supply terminal, an input point (in) and an output point (out). At least one of the Vcc power supply terminal, the input point or the output point is connected via an overvoltage protection circuit to the substrate terminal or earthing point, and the overvoltage protection circuit includes means with diode action formed in the substrate between the relevant terminal and the substrate terminal or earthing point. The means include two or more diode elements of the Zener type connected in series. The substrate of a first conductivity type is provided with a well (WLL) of a second, opposed conductivity type formed in the substrate.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: March 11, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Henricus Antonius Lambertus Van Lieverloo
  • Integrated circuit provided with overvoltage protection and method for manufacture thereof
    Publication number: 20020043688
    Abstract: The invention concerns an integrated circuit, comprising a substrate (SBSTR) with sub-circuits provided with a number of terminals, including a substrate terminal or earthing point (GND), a Vcc power supply terminal, an input point (in) and an output point (out). At least one of the Vcc power supply terminal, the input point or the output point is connected via an overvoltage protection circuit to the substrate terminal or earthing point, wherein the overvoltage protection circuit comprises means with diode action formed in the substrate between the relevant terminal and the substrate terminal or earthing point. The means comprise two or more diode elements of the Zener type connected in series. The substrate of a first conductivity type is provided with a well (WLL) of a second, opposed conductivity type formed in the substrate.
    Type: Application
    Filed: October 11, 2001
    Publication date: April 18, 2002
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventor: Henricus Antonius Lambertus Van Lieverloo