Abstract: The invention relates to a cleaning device for detecting and removing contaminants on a mould for encapsulating electronic components, especially semiconductors, including a light source for irradiating a mould surface; an optical detector for detecting irradiated contaminants on the mould surface; a moveable cleaner for removing the contaminants; and a controller for the cleaner. The invention also relates to a cleaning method for such a mould.

Abstract: The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.

Abstract: The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.

Abstract: The present invention relates to a handler device for handling substrates during semiconductor production, comprising a handling unit having a substrate facing side to be directed to the substrate to be handled, said handling unit being provided with at least three substrate edge grippers protruding from the substrate facing side of the handling unit. The substrate edge grippers are configured to grip the edge of a substrate to be handled, wherein the at least three substrate edge grippers comprise: at least two controlled moveable positioning grippers for gripping the edge of the substrate at two controlled positions and at least one clamping gripper for exerting a controlled clamping force onto the edge of the substrate at least partially directed towards the positioning grippers. The handler further comprises individually controllable actuators connected to the handling unit for independent control of each of the controlled moveable positioning grippers.

Abstract: The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.

Abstract: The present invention relates to a handler device for handling substrates during semiconductor production, comprising a handling unit having a substrate facing side to be directed to the substrate to be handled, said handling unit being provided with at least three substrate edge grippers protruding from the substrate facing side of the handling unit. The substrate edge grippers are configured to grip the edge of a substrate to be handled, wherein the at least three substrate edge grippers comprise: at least two controlled moveable positioning grippers for gripping the edge of the substrate at two controlled positions and at least one clamping gripper for exerting a controlled clamping force onto the edge of the substrate at least partially directed towards the positioning grippers. The handler further comprises individually controllable actuators connected to the handling unit for independent control of each of the controlled moveable positioning grippers.

Abstract: The invention relates to a press for encapsulating electronic components mounted on a carrier, comprising: at least two press parts displaceable relative to each other, a drive system for the displacement of the press parts, and an intelligent control adapted to control the drive system of the press parts wherein the drive system comprises at least two individual controllable actuators, the intelligent control further connects to plural displacement sensors for detecting the relative displacement of the press parts, and wherein the intelligent control is adapted to control the actuators of the drive system dynamically over time based on the measured values detected with the displacement sensors. The invention also relates to an actuator set to convert a prior art press into a press according to the present invention as well as to a method for encapsulating electronic components mounted on a carrier.