Abstract: A semiconductor device may include a semiconductor substrate, a wire placed along at least a portion of a perimeter of the semiconductor substrate, and processing circuitry connected to the wire, the processing circuitry to, based on a signal from the wire, determine whether or not the semiconductor device is damaged.

Abstract: An apparatus for a hearing device includes a first voltage regulator with an output terminal; a first voltage reference; a second voltage regulator with an output terminal; a switching element; and a decoupling element; wherein the switching element and the decoupling element are operatively between the first voltage reference and the first voltage regulator; wherein the output terminal of the first voltage regulator shares a same electrical node as the output terminal of the second voltage regulator; and wherein the first voltage regulator is configured to provide a first output voltage in response to applied battery power, the second voltage regulator is configured to provide a second output voltage if a certain condition is fulfilled, and the switching element is configured to disconnect the first voltage reference from the decoupling element if the condition is fulfilled.

Abstract: An interface pad circuit configured for conveying an electrical signal from a semiconductor chip component to a component external to the semiconductor chip component, the interface pad circuit includes: a control circuit; a plurality of semiconductor elements, the semiconductor elements having respective bulk terminals and being controlled by the control circuit; and a connection pad; wherein at least two of the semiconductor elements are configured for providing a plurality of non-zero logic voltage levels to the connection pad; and wherein the control circuit is configured to apply a voltage level to the bulk terminals of the at least two of the semiconductor elements providing the non-zero logic voltage levels, the voltage level applied by the control circuit corresponding to the highest voltage level of the plurality of non-zero logic voltage levels.

Abstract: An interface pad circuit configured for conveying an electrical signal from a semiconductor chip component to a component external to the semiconductor chip component, the interface pad circuit includes: a control circuit; a plurality of semiconductor elements, the semiconductor elements having respective bulk terminals and being controlled by the control circuit; and a connection pad; wherein at least two of the semiconductor elements are configured for providing a plurality of non-zero logic voltage levels to the connection pad; and wherein the control circuit is configured to apply a voltage level to the bulk terminals of the at least two of the semiconductor elements providing the non-zero logic voltage levels, the voltage level applied by the control circuit corresponding to the highest voltage level of the plurality of non-zero logic voltage levels.

Abstract: An apparatus for a hearing device includes a first voltage regulator with an output terminal; a first voltage reference; a second voltage regulator with an output terminal; a switching element; and a decoupling element; wherein the switching element and the decoupling element are operatively between the first voltage reference and the first voltage regulator; wherein the output terminal of the first voltage regulator shares a same electrical node as the output terminal of the second voltage regulator; and wherein the first voltage regulator is configured to provide a first output voltage in response to applied battery power, the second voltage regulator is configured to provide a second output voltage if a certain condition is fulfilled, and the switching element is configured to disconnect the first voltage reference from the decoupling element if the condition is fulfilled.