Patents by Inventor Henrik I. Hoyer

Henrik I. Hoyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Functional lid for RF power package
    Patent number: 6392298
    Abstract: A packaged integrated circuit device includes a substrate including a first circuit component mounted thereon, a first conductor extending from the first circuit component, and a dielectric lid. The dielectric lid includes a component mounting surface, a second circuit component mounted on the component mounting surface, and a second conductor extending from the second circuit component. The dielectric lid is adapted to engage with the substrate such that the first circuit component is in electrical communication with the second circuit component. The second circuit component may comprises an impedance matching circuit. The circuit device may also include fastening means for securing the lid to the substrate. The fastening means may comprise an adhesive, solder, or a spring biased member.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: May 21, 2002
    Assignee: Ericsson Inc.
    Inventors: Larry Leighton, Bengt Ahl, Thomas Moller, Henrik I. Hoyer