Abstract: The present invention relates to a composition comprising a dry preparation of Alpinia galanga (L.) Willd (Zingiberaceae) or Alpinia conchigera Griff and a plant extract comprising compounds with anti-oxidative activity, such as an extract of Punica granatum. Also disclosed herein is a method of improving semen quality by administering said composition to a male subject in need thereof.

Abstract: Data type configuration data is expressed and deployed to a database system to obtain a relational representation of the data types in addition to the compile code representation. Users or developers extend the data types by adding data to the relational representation, and the runtime environment operates off of the relational representation. Because the data types are extended (such as by creating new entities) using the data type tables in the relational representation, the extensions obtain the benefits of the type checking performed at compile time.

Abstract: The present invention relates to a composition comprising a dry preparation of Alpinia galanga (L.) Willd (Zingiberaceae) or Alpinia conchigera Griff and a plant extract comprising compounds with anti-oxidative activity, such as an extract of Punica granatum. Also disclosed herein is a method of improving semen quality by administering said composition to a male subject in need thereof.

Abstract: The present invention relates to a composition comprising a dry preparation of Alpinia galanga (L.) Willd (Zingiberaceae) or Alpinia conchigera Griff. and a plant extract comprising compounds with anti-oxidative activity, such as an extract of Punica granatum. Also disclosed herein is a method of improving semen quality by administering said composition to a male subject in need thereof.

Abstract: Data type configuration data is expressed and deployed to a database system to obtain a relational representation of the data types in addition to the compile code representation. Users or developers extend the data types by adding data to the relational representation, and the runtime environment operates off of the relational representation. Because the data types are extended (such as by creating new entities) using the data type tables in the relational representation, the extensions obtain the benefits of the type checking performed at compile time.

Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A method for manufacturing a micromechanical mass-spring system that includes a mass and an asymmetric spring is provided. A silicon substrate is provided, and the silicon substrate is etched to define a section upon which the asymmetric spring is to be formed. A surface layer is formed on the surface of the substrate. Etching is then performed to form the asymmetric spring from the surface layer, and further etching releases the mass and spring from the substrate. A device that includes a micromechanical mass-spring system manufactured according to the method is also provided.

Abstract: A method for producing a multi-layer device. The method initially providing a substrate which comprises a support region for supporting an electrical component, then forming an electrically conductive bond layer on a surface of the substrate. The bond is configured to surround the region for supporting the component. The next step in the method is to provide an encasing layer in contact with the bond layer, such that the component is encased between the substrate and the encasing layer. The final step involves bonding the encasing layer to the bond layer to form a sealed cavity which encloses the component. Further, a multi-layer device is provided. The device comprises a substrate, at least one electrical component which is located on the substrate, an electrically conductive bond layer and an encasing layer. The bond layer is formed on the substrate and surrounds the electrical components and the encasing layer is bonded to the bond layer to form a sealed cavity encasing the components therein.

Abstract: A capacitive-type sensor comprises a glass plate having an electrode formed thereon, and a micromachined structure formed from a semiconductor material and having an insulating rim formed thereon. A conducting seal is formed on the insulating rim and arranged to be bonded to the glass substrate to define an enclosed cavity containing the electrode, to thereby define a capacitive element, the conducting seal being arranged, in use, to have an electrical signal passed there through to determine a capacitance thereof which is indicative of the parameter to be determined by the sensor.

Abstract: A capacitive-type pressure sensor comprising a glass plate having an electrode formed thereon. A diaphragm is formed from a semiconductor material and bonded to the glass substrate to define an enclosed cavity containing at least a portion of the electrode, to thereby define a capacitive element, through which, in use, an electrical signal may be passed to determine a capacitance thereof which is indicative of the pressure to be determined.

Abstract: A method for producing a multi-layer device. The method initially providing a substrate which comprises a support region for supporting an electrical component, then forming an electrically conductive bond layer on a surface of the substrate. The bond is configured to surround the region for supporting the component. The next step in the method is to provide an encasing layer in contact with the bond layer, such that the component is encased between the substrate and the encasing layer. The final step involves bonding the encasing layer to the bond layer to form a sealed cavity which encloses the component.

Abstract: A device having electrical and mechanical components. The device comprises multiple layers in which: a first layer or set of layers arranged is to function as one or more electrodes or conductors; and a second layer is arranged to function as one or more press contracts or wire contacts or wire bond pads. The second layer has different physical properties than the first layer, wherein the first layer or set of layers is relatively hard or tough and the second layer is relatively soft or malleable. A corresponding method is provided.

Abstract: A pedestal structure and its fabrication method stress release assembly of micromechanical sensors, in particular acceleration sensor, angular rate sensors, inclination sensors or angular acceleration. At least one silicon seismic mass is used as sensing element. The at least one silicon seismic mass is joined to the silicon frame via at least one assembly pedestal, the surface of which is bonded to a covering wafer, either glass or silicon.

Abstract: A capacitive-type pressure sensor comprising a glass plate having an electrode formed thereon. A diaphragm is formed from a semiconductor material and bonded to the glass substrate to define an enclosed cavity containing at least a portion of the electrode, to thereby define a capacitive element, through which, in use, an electrical signal may be passed to determine a capacitance thereof which is indicative of the pressure to be determined.

Abstract: A method of manufacturing an angular-rate sensor by fabricating components of the angular-rate sensor on a silicon substrate, the components of the angular rate sensor including one or more masses, a support beam and buried conductors. Detection means are provided and the components are sealed in a cavity between a first glass plate and a second glass plate by anodic bonding. This enables angular rate sensors to be fabricated using low cost silicon wafers.