Patents by Inventor Henrik Laurids Hvims

Henrik Laurids Hvims has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid state silicon-based condenser microphone
    Patent number: 6088463
    Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: July 11, 2000
    Assignee: Microtronic A/S
    Inventors: Pirmin Rombach, Matthias Mullenborn, Ole Hansen, Matthias Heschel, Siebe Bouwstra, Maja Amskov Gravad, Henrik Laurids Hvims
  • Solid state silicon-based condenser microphone
    Patent number: RE42347
    Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: May 10, 2011
    Assignee: Epcos PTE Ltd.
    Inventors: Pirmin Rombach, Matthias Müllenborn, Ole Hansen, Matthias Heschel, Siebe Bouwstra, Maja Amskov Gravad, Henrik Laurids Hvims, Jorgen B. Elmer, legal representative