Patents by Inventor Henry A. Wynands

Henry A. Wynands has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of fabricating microneedle arrays using sacrificial molds, and microneedle arrays fabricated thereby
    Patent number: 7332197
    Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: February 19, 2008
    Assignee: Memscap S.A.
    Inventors: Robert L. Wood, Henry A. Wynands, Karen W. Markus
  • Methods of fabricating microneedle arrays using sacrificial molds, and microneedle arrays fabricated thereby
    Publication number: 20030111759
    Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.
    Type: Application
    Filed: November 26, 2002
    Publication date: June 19, 2003
    Inventors: Robert L. Wood, Henry A. Wynands, Karen W. Markus
  • Methods of fabricating microneedle arrays using sacrificial molds
    Patent number: 6511463
    Abstract: Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: January 28, 2003
    Assignee: JDS Uniphase Corporation
    Inventors: Robert L. Wood, Henry A. Wynands, Karen W. Markus