Patents by Inventor Henry Abbink

Henry Abbink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080000606
    Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.
    Type: Application
    Filed: September 11, 2007
    Publication date: January 3, 2008
    Inventors: Henry Abbink, William Debley, Christine Geosling, Daryl Sakaida, Robert Stewart
  • Publication number: 20060139029
    Abstract: An NMR gyroscope in one example comprises a support structure affixed within an enclosure, an NMR cell affixed to the support structure, a plurality of permanent magnets disposed about the NMR cell to produce a magnetic field within the cell, and a field coil disposed proximate the cell to produce a modulated magnetic field transverse to the magnetic field produced by the permanent magnets.
    Type: Application
    Filed: December 20, 2005
    Publication date: June 29, 2006
    Inventors: Henry Abbink, Edward Kanegsberg, Ralph Patterson
  • Publication number: 20060132130
    Abstract: A cell in one example comprises an alkali metal and a coating of parylene on an interior surface of the cell. In one implementation, the alkali metal may be an optically pumped gaseous phase of an alkali metal. The parylene coating minimizes interaction of the excited state of the alkali metal, increases lifetime of the excited state, and minimizes interaction of nuclear spin states with the cell walls.
    Type: Application
    Filed: December 20, 2005
    Publication date: June 22, 2006
    Inventors: Henry Abbink, Edward Kanegsberg, Kenneth Marino, Charles Volk
  • Publication number: 20060125068
    Abstract: An apparatus comprising at least one multilayer wafer includes a device layer adjacent to a barrier layer, and the device layer includes at least two photoconductive regions separated by an etched channel extending through the device layer. In some instances the apparatus may be an accelerometer having two photodiodes formed on a silicon-on-insulator (SOI) wafer with the photodiodes defined by one or more etched channels extending through the device layer of the SOI wafer. Also disclosed are methods for forming such an apparatus.
    Type: Application
    Filed: December 9, 2004
    Publication date: June 15, 2006
    Inventor: Henry Abbink
  • Patent number: 7038293
    Abstract: An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: May 2, 2006
    Assignee: Northrop Grumman Corp.
    Inventors: Youngmin A. Choi, Christine Geosling, Henry Abbink
  • Publication number: 20050236460
    Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.
    Type: Application
    Filed: April 26, 2004
    Publication date: October 27, 2005
    Inventors: Henry Abbink, William Debley, Christine Geosling, Daryl Sakaida, Robert Stewart
  • Publication number: 20050212077
    Abstract: An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 29, 2005
    Inventors: Youngmin Choi, Christine Geosling, Henry Abbink