Patents by Inventor Henry Andre Christange

Henry Andre Christange has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10763827
    Abstract: A delay line includes one or more phase-shifting cells, where each phase-shifting cell includes a high-pass filter circuit that may be selectively coupled to or decoupled from a transmission line. The filter circuit is couplable in parallel with the transmission line and shifts a signal conveyed through the transmission line by a predetermined phase angle. The high-pass filter circuit includes one or more capacitors and one or more reactance elements (e.g., inductors). The selective coupling may be achieved using multi-gate transistors.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 1, 2020
    Assignee: NXP B.V.
    Inventor: Henry Andre Christange
  • Patent number: 10615510
    Abstract: A feed structure for an electrical component includes a slot structure with first and second longitudinal sections opposing one another and first and second interconnect segments opposing one another. The first and second interconnect segments couple the first longitudinal section with the second longitudinal section to form an opening extending through the slot structure, the opening being surrounded by the first longitudinal section, the first interconnect segment, the second longitudinal section, and the second interconnect segment. A first feed node is electrically connected to the slot structure at an intermediate region between first and second ends of the first longitudinal section, and second feed nodes are electrically coupled to the slot structure along the second longitudinal section. In a device or module, the second feed nodes are configured for electrical connection to the electrical component.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: April 7, 2020
    Assignee: NXP USA, Inc.
    Inventors: Ibrahim Khalil, Hussain Hasanali Ladhani, Henry Andre Christange
  • Publication number: 20200099140
    Abstract: A feed structure for an electrical component includes a slot structure with first and second longitudinal sections opposing one another and first and second interconnect segments opposing one another. The first and second interconnect segments couple the first longitudinal section with the second longitudinal section to form an opening extending through the slot structure, the opening being surrounded by the first longitudinal section, the first interconnect segment, the second longitudinal section, and the second interconnect segment. A first feed node is electrically connected to the slot structure at an intermediate region between first and second ends of the first longitudinal section, and second feed nodes are electrically coupled to the slot structure along the second longitudinal section. In a device or module, the second feed nodes are configured for electrical connection to the electrical component.
    Type: Application
    Filed: September 24, 2018
    Publication date: March 26, 2020
    Inventors: Ibrahim Khalil, Hussain Hasanali Ladhani, Henry Andre Christange
  • Patent number: 10069462
    Abstract: A multiple-stage RF amplifier and a packaged amplifier device include driver and final-stage transistors, each having a control terminal, a first current-carrying terminal, and a second current-carrying terminal. The control terminal of the final-stage transistor is electrically coupled to the first current-carrying terminal of the driver transistor. The amplifier further includes an inter-stage circuit coupled between the first current carrying terminal of the driver transistor and a voltage reference node. The inter-stage circuit includes a first inductance, a first capacitor, and a second capacitor. The first inductance and the first capacitor are coupled in series between the first current carrying terminal and the voltage reference node, with an intermediate node between the first inductance and the first capacitor. The second capacitor has a first terminal electrically coupled to the intermediate node and a second terminal electrically coupled to the voltage reference node.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: September 4, 2018
    Assignee: NXP USA, INC.
    Inventors: Seungkee Min, Margaret A. Szymanowski, Henry Andre Christange
  • Publication number: 20180248521
    Abstract: A multiple-stage RF amplifier and a packaged amplifier device include driver and final-stage transistors, each having a control terminal, a first current-carrying terminal, and a second current-carrying terminal. The control terminal of the final-stage transistor is electrically coupled to the first current-carrying terminal of the driver transistor. The amplifier further includes an inter-stage circuit coupled between the first current carrying terminal of the driver transistor and a voltage reference node. The inter-stage circuit includes a first inductance, a first capacitor, and a second capacitor. The first inductance and the first capacitor are coupled in series between the first current carrying terminal and the voltage reference node, with an intermediate node between the first inductance and the first capacitor. The second capacitor has a first terminal electrically coupled to the intermediate node and a second terminal electrically coupled to the voltage reference node.
    Type: Application
    Filed: February 27, 2017
    Publication date: August 30, 2018
    Inventors: Seungkee Min, Margaret A. Szymanowski, Henry Andre Christange