Patents by Inventor Henry Atkinson Nye, III

Henry Atkinson Nye, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond pad structure and method for reduced downward force wirebonding
    Patent number: 6478212
    Abstract: A bond pad structure for an integrated circuit has bondable base member for receiving a wire bonded thereon. A cavity is formed within the base member, with the cavity being configured to capture the wire therein. The cavity has one end having a first width and an opposite end having a second width, with the first width being greater than second width.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: November 12, 2002
    Assignee: International Business Machines Corporation
    Inventors: Brett H. Engel, Vincent James McGahay, Henry Atkinson Nye, III
  • Dry film resist removal in the presence of electroplated C4's
    Patent number: 5904156
    Abstract: A process for wet chemically stripping dry, thick film photoresists in semiconductor applications. This process includes contacting the silicon wafer with a stripping solution and agitating the solution. The process may be performed in a strip tank having a chemical stripping solution, and nitrogen or other inert gases may be provided through a pressurized tube to cause bubbling in the solution and to strip the wafer.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: May 18, 1999
    Assignee: International Business Machines Corporation
    Inventors: Gerald Gerard Advocate, Jr., Lisa A. Fanti, Henry Atkinson Nye, III