Patents by Inventor Henry B. Wettersten

Henry B. Wettersten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10787753
    Abstract: Anodized substrates having laser markings and methods for forming the same are described. According to some embodiments, the methods involve forming a feature on a substrate using a laser prior to anodizing. The laser energy and pulse width can be chosen so as to provide a particular topology to a surface of the substrate that, after anodizing, absorbs incoming light and imparts a dark appearance to the feature. In some cases, the methods involve forming a coarse oxide layer, which is removed prior to anodizing. Since the laser marking is performed prior to anodizing, the anodized substrates are free from laser-induced cracks, thereby making the anodized substrates more corrosion resistant than conventional laser-marked anodized substrates. The techniques are well suited for forming features on consumer products that may be exposed to water or other corrosion-inducing agents.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: September 29, 2020
    Assignee: APPLE INC.
    Inventors: Michael M. Li, Henry B. Wettersten, Brian M. Gable, Dakota A. Bass
  • Patent number: 10372166
    Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: August 6, 2019
    Assignee: APPLE INC.
    Inventors: Brian M. Gable, Carlo Di Nallo, Colin M. Ely, Craig A. Horton, Erik G. de Jong, Fletcher R. Rothkopf, Henry B. Wettersten, Hoishun Li, Jason C. Sauers, Jayesh Nath, Mario Martinis, Mattia Pascolini, Michael P. Coleman, Rex T. Ehman, Zheyu Wang
  • Publication number: 20180073158
    Abstract: Anodized substrates having laser markings and methods for forming the same are described. According to some embodiments, the methods involve forming a feature on a substrate using a laser prior to anodizing. The laser energy and pulse width can be chosen so as to provide a particular topology to a surface of the substrate that, after anodizing, absorbs incoming light and imparts a dark appearance to the feature. In some cases, the methods involve forming a coarse oxide layer, which is removed prior to anodizing. Since the laser marking is performed prior to anodizing, the anodized substrates are free from laser-induced cracks, thereby making the anodized substrates more corrosion resistant than conventional laser-marked anodized substrates. The techniques are well suited for forming features on consumer products that may be exposed to water or other corrosion-inducing agents.
    Type: Application
    Filed: December 14, 2016
    Publication date: March 15, 2018
    Inventors: Michael M. LI, Henry B. WETTERSTEN, Brian M. GABLE, Dakota A. BASS
  • Publication number: 20180017995
    Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 18, 2018
    Inventors: Brian M. Gable, Carlo Di Nallo, Colin M. Ely, Craig A. Horton, Erik G. de Jong, Fletcher R. Rothkopf, Henry B. Wettersten, Hoishun Li, Jason C. Sauers, Jayesh Nath, Mario Martinis, Mattia Pascolini, Michael P. Coleman, Rex T. Ehman, Zheyu Wang