Patents by Inventor Henry Beppu

Henry Beppu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic glass integrated circuit package with integral ground and power planes
    Patent number: 5258575
    Abstract: A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to serve as a ground plane, and a second layer of conductive material adjacent the ceramic base to serve as a power plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground and power planes but physically separated therefrom. In one embodiment, integral decoupling capacitors are further included on the base substrate. Incorporation of ground and power planes and decoupling capacitors into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.
    Type: Grant
    Filed: April 22, 1991
    Date of Patent: November 2, 1993
    Assignee: Kyocera America, Inc.
    Inventors: Henry Beppu, Toshi Kusuhara, Aki Nomura
  • Ceramic-glass integrated circuit package with integral ground and power planes
    Patent number: 5134246
    Abstract: A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to serve as a ground plane, and a second layer of conductive material adjacent the ceramic base to serve as a power plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground and power planes but physically separated therefrom. In one embodiment, integral decoupling capacitors are further included on the base substrate. Incorporation of ground and power planes and decoupling capacitors into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.
    Type: Grant
    Filed: January 16, 1991
    Date of Patent: July 28, 1992
    Assignee: Kyocera America, Inc.
    Inventors: Henry Beppu, Toshi Kusuhara, Aki Nomura
  • Ceramic-glass integrated circuit package with ground plane
    Patent number: 4992628
    Abstract: A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve as a ground plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground plane but physically separated therefrom. Incorporation of a ground plane into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.
    Type: Grant
    Filed: May 7, 1990
    Date of Patent: February 12, 1991
    Assignee: Kyocera America, Inc.
    Inventors: Henry Beppu, Toshi Kushuhara, Aki Nomura