Abstract: A contact comprising: (a) a contact housing, said contact housing being narrower than a cavity of a connector such that said contact housing is laterally movable within said cavity; (b) an optical interface for receiving a ferrule of a mating connector contact; (c) optoelectrical circuitry optically connected to said optical interface, wherein said optical interface and said optoelectrical circuitry are held rigidly in relation to each other within said contact housing; and (d) an electrical interface electrically connected to said optoelectrical circuitry and configured for electrical connection to a circuit board, wherein said electrical interface comprising at least a flexible cable to provide compliance between said optoelectrical circuitry and said circuit board.

Abstract: A method of preparing an overmolded optical fiber assembly comprising: (a) placing at least one flexible optical circuit in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being disposed within said bottom overmold cavity to define a first space between said substrate and said bottom surface; (b) flowing a polymer in at least said first space; (c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate; (d) flowing a polymer in at least a portion of said second space; and (e) removing said bottom and top molds to release said overmolded optical circuit.

Abstract: A method of preparing an overmolded optical fiber assembly comprising: (a) placing at least one flexible optical circuit in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being disposed within said bottom overmold cavity to define a first space between said substrate and said bottom surface; (b) flowing a polymer in at least said first space; (c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate; (d) flowing a polymer in at least a portion of said second space; and (e) removing said bottom and top molds to release said overmolded optical circuit.