Patents by Inventor Henry C. Valcour, III

Henry C. Valcour, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High temperature superconductor wire bundling system and method
    Patent number: 9887025
    Abstract: A system for bundling a plurality of high temperature superconductor tapes into a flexible cable, includes a first alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of the tapes arranged with a wide surface oriented at a first angle. There is a second alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of said tapes arranged with the wide surface oriented at a second angle. The first angle is transverse to the second angle and plastically deforms the tapes to impart a twist pitch in the tapes. There is a forming member spaced from the second alignment device for receiving the plurality of high temperature superconductor tapes with the imparted twist pitch and forming them into a bundle of high temperature superconductor tapes of the high temperature superconductor tapes with the imparted twist pitch.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: February 6, 2018
    Assignee: American Superconductor Corporation
    Inventors: Glenn C. Driscoll, Henry C. Valcour, III, Paul Yankauskas, Daniel B. George, II, Alan W. Baum, Timothy G. Freidhoff, Bryan P. Tipton, Patricia D. Huber
  • HIGH TEMPERATURE SUPERCONDUCTOR WIRE BUNDLING SYSTEM AND METHOD
    Publication number: 20170092392
    Abstract: A system for bundling a plurality of high temperature superconductor tapes into a flexible cable, includes a first alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of the tapes arranged with a wide surface oriented at a first angle. There is a second alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of said tapes arranged with the wide surface oriented at a second angle. The first angle is transverse to the second angle and plastically deforms the tapes to impart a twist pitch in the tapes. There is a forming member spaced from the second alignment device for receiving the plurality of high temperature superconductor tapes with the imparted twist pitch and forming them into a bundle of high temperature superconductor tapes of the high temperature superconductor tapes with the imparted twist pitch.
    Type: Application
    Filed: September 30, 2015
    Publication date: March 30, 2017
    Inventors: Glenn C. Driscoll, Henry C. Valcour, III, Paul Yankauskas, Daniel B. George, II, Alan W. Baum, Timothy G. Freidhoff, Bryan P. Tipton, Patricia D. Huber
  • Mitigating the effects of defects in high temperature semiconductor wires
    Patent number: 8680015
    Abstract: A method includes locating a defect in a first segment of high temperature superconducting wire. A second segment of high temperature superconducting wire is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: March 25, 2014
    Assignee: American Superconductor Corporation
    Inventors: Henry C. Valcour, III, Peter D. Antaya, John Gannon, Eric R. Podtburg, Subramaniam Anandakugan, William L. Carter, Hong Cai, Michael A. Tanner, David Crotzer, Alexander Otto, Dana Krause
  • MITIGATING THE EFFECTS OF DEFECTS IN HIGH TEMPERATURE SUPERCONDUCTOR WIRES
    Publication number: 20120245035
    Abstract: A method includes locating a defect in a first segment of high temperature superconducting wire. A second segment of high temperature superconducting wire is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 27, 2012
    Applicant: American Superconductor Corporation
    Inventors: Eric R. Podtburg, Henry C. Valcour, III, Subramaniam Anandakugan, Peter D. Antaya, William L. Carter, John Gannon, Hong Cai, Michael A. Tanner, David Crotzer, Alexander Otto, Dana Krause