Abstract: An input-output circuit is coupled to a plurality of serial communication paths and to a physical point-to-point interface. The input-output circuit is configured to transmit data received on the plurality of serial communication paths over the physical point-to-point interface. An application circuit is coupled to the input-output circuit and is configured to communicate via a first one of the paths in performing application functions. A bridge circuit is coupled to the input-output circuit and is configured to communicate via a second one of the paths. A debug circuit is coupled to the application circuit and to the bridge circuit. The debug circuit is configured to capture debug data of the application circuit and provide the debug data to the bridge circuit for communication via the second one of the paths.

Abstract: An application specific integrated circuit (ASIC) and method of manufacture. The ASIC includes a substrate layer, at least one metal layer and an operational block. The metal layer is formed above the substrate layer. The operational block is formed in the substrate layer and the metal layer, and is definable by a two-dimensional boundary. The operational block includes a plurality of operational logic gates, a first subgroup of spare logic gates, a second subgroup of spare logic gates, operational wiring and spare gate wiring. The operational logic gates, the first subgroup and the second subgroup are formed on the substrate layer, with the first subgroup being spaced from the second subgroup. The operational wiring is routed into the metal layer and interconnects the operational logic gates to configure the operational block to perform a desired operation. The spare gate wiring is similarly routed into the metal layer.