Patents by Inventor Henry Chu

Henry Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250013373
    Abstract: A method includes determining a write amplification factor for a particular NAND-based memory device and a host coupled to the NAND-based memory device and includes calculating a bandwidth of the host. Based on the write amplification factor and the bandwidth of the host, a resource of the NAND-based memory device is allocated between the host and a garbage collection process of the NAND-based memory device.
    Type: Application
    Filed: September 24, 2024
    Publication date: January 9, 2025
    Inventors: David Dreyer, Henry Chu, Joey Rodgers
  • Patent number: 12131039
    Abstract: A method includes determining a write amplification factor for a particular NAND-based memory device and a host coupled to the NAND-based memory device and includes calculating a bandwidth of the host. Based on the write amplification factor and the bandwidth of the host, a resource of the NAND-based memory device is allocated between the host and a garbage collection process of the NAND-based memory device.
    Type: Grant
    Filed: April 5, 2023
    Date of Patent: October 29, 2024
    Assignee: SK Hynix NAND Product Solutions Corp.
    Inventors: David Dreyer, Henry Chu, Joey Rodgers
  • Publication number: 20240338133
    Abstract: A method includes determining a write amplification factor for a particular NAND-based memory device and a host coupled to the NAND-based memory device and includes calculating a bandwidth of the host. Based on the write amplification factor and the bandwidth of the host, a resource of the NAND-based memory device is allocated between the host and a garbage collection process of the NAND-based memory device.
    Type: Application
    Filed: April 5, 2023
    Publication date: October 10, 2024
    Inventors: David Dreyer, Henry Chu, Joey Rodgers
  • Publication number: 20240220111
    Abstract: Mechanisms for improving read command processing times in a solid-state drive (SSD) are provided, the mechanisms comprising: determining a workload type of an SSD; in response to determining that the workload type is a pure read workload type: determining at least one command size into which an original background write is to be split-up using at least one hardware processor; and splitting-up the background write into a plurality of split background writes, each having one of the determined at least one command size. In some embodiments, the at least one command size accounts for a page of the physical medium of the SSD. In some embodiments, the at least one command size includes at least two different sizes. In some embodiments, the mechanisms further comprise combining two or more split background writes. In some embodiments, the original background write is split-up before being placed in a channel queue.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Inventors: Mark Anthony Sumabat Golez, Henry Chu, Darshan Mallapur Vishwanath, Sarvesh Varakabe Gangadhar, David J. Pelster
  • Patent number: 11487318
    Abstract: In some examples, an apparatus can include an arm, a cam connected to the arm, a first spring located around a first strut, where the first spring is oriented at a first angle relative to a base of the apparatus and the first strut is connected to the cam, a second spring located around a second strut, where the second spring is oriented at a second angle relative to the base of the apparatus and the second strut is connected to the cam, where the first spring and the second spring linearly compress in response to rotation of the arm from a vertical orientation to a horizontal orientation relative to the base of the apparatus.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: November 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arthur Zarnowitz, Henry Chu, Victor Su, Andrew Guscott, Marcus Hoggarth, Isaac Teece, Harc Lee, Gianluca Berruti, Kang-Han Cheng, Sung-Hsuan Weng
  • Patent number: 11460880
    Abstract: In some examples, an apparatus can include an arm and a cover connected to the arm, where the cover conceals an inner portion of the apparatus when the arm is in a vertical orientation relative to a base of the apparatus, and the cover is concealed in the inner portion of the apparatus when the arm is in a horizontal orientation relative to the base of the apparatus.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: October 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arthur Zarnowitz, Henry Chu, Victor Su, Marcus Hoggarth, Isaac Teece, Andrew Guscott, Harc Lee, Gianluca Berruti, Kang-Han Cheng, Sung-Hsuan Weng
  • Publication number: 20210341964
    Abstract: In some examples, an apparatus can include an arm and a cover connected to the arm, where the cover conceals an inner portion of the apparatus when the arm is in a vertical orientation relative to a base of the apparatus, and the cover is concealed in the inner portion of the apparatus when the arm is in a horizontal orientation relative to the base of the apparatus.
    Type: Application
    Filed: April 30, 2018
    Publication date: November 4, 2021
    Inventors: Arthur ZARNOWITZ, Henry CHU, Victor SU, Marcus HOGGARTH, Isaac TEECE, Andrew GUSCOTT, Harc LEE, Gianluca BERRUTI, Kang-Han CHENG, Sung-Hsuan WENG
  • Publication number: 20210333821
    Abstract: In some examples, an apparatus can include an arm, a cam connected to the arm, a first spring located around a first strut, where the first spring is oriented at a first angle relative to a base of the apparatus and the first strut is connected to the cam, a second spring located around a second strut, where the second spring is oriented at a second angle relative to the base of the apparatus and the second strut is connected to the cam, where the first spring and the second spring linearly compress in response to rotation of the arm from a vertical orientation to a horizontal orientation relative to the base of the apparatus.
    Type: Application
    Filed: April 30, 2018
    Publication date: October 28, 2021
    Inventors: Arthur Zarnowitz, Henry Chu, Victor Su, Andrew Guscott, Marcus Hoggarth, Isaac Teece, Harc Lee, Gianluca Berroti, Kang-Han Cheng, Sung-Hsuan Weng
  • Patent number: 8732621
    Abstract: A method, interface, and apparatus for expressing data objects is described.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: May 20, 2014
    Assignee: Senovation, L.L.C.
    Inventors: Shixian Chu, Jinfeng Chen, Zonghuan Wu, Chee-Hung Henry Chu, Vijay V Raghavan
  • Publication number: 20110029933
    Abstract: A method, interface, and apparatus for expressing data objects is described.
    Type: Application
    Filed: January 23, 2008
    Publication date: February 3, 2011
    Inventors: Shixian Chu, Jinfeng Chen, Zonghuan Wu, Chee-Hung Henry Chu, Vijay V. Raghavan
  • Patent number: D790543
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: June 27, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Henry Chu
  • Patent number: D797736
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: September 19, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Henry Chu
  • Patent number: D817329
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: May 8, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Henry Chu, Jack Godfrey Wood, Harc Lee, Marcus Hoggarth
  • Patent number: D887409
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: June 16, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Henry Chu, Jack Godfrey Wood, Harc Lee, Marcus Hoggarth
  • Patent number: D895618
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: September 8, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rahul Patil, Henry Chu
  • Patent number: D898025
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 6, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D902939
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: November 24, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Henry Chu
  • Patent number: D937832
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D938421
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 14, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D1063933
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: February 25, 2025
    Assignee: Hewlett-Packard Development Co., L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong