Patents by Inventor Henry D. Bathan, Jr.

Henry D. Bathan, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with ground ring
    Patent number: 7671463
    Abstract: An integrated circuit package system is provided forming a ring above a paddle and an external interconnect, mounting an integrated circuit die on the paddle, connecting the integrated circuit die and the external interconnect, the external interconnect and the ring, and the ring and the integrated circuit die, and encapsulating the integrated circuit die, the ring, and a portion of the external interconnect and the paddle.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: March 2, 2010
    Assignee: STATS ChipPAC Ltd.
    Inventors: Zigmund Ramirez Camacho, Henry D. Bathan, Jr., Arnel Trasporto, Jeffrey D. Punzalan