Abstract: In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source.

Abstract: High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7.

Abstract: Optical subassemblies including integral thermoelectric cooler (TEC) drivers. In one example embodiment, an optical subassembly includes a thermoelectric cooler (TEC) driver, a first substrate to which the TEC driver is structurally mounted, a second substrate, a laser temperature sensor structurally mounted on the second substrate, a TEC thermally coupled to the second substrate, and a thermal resistance mechanism including a thermally insulating material. The laser temperature sensor is structurally coupled directly between a laser and the second substrate with the laser being in direct contact with the laser temperature sensor.

Abstract: Intraoperative radiation detection probes and cameras for use in surgical or transcutaneous procedures or procedures incorporating probes inserted through body orifices to aid in the location, detection and removal of radiation labeled cells, abnormal tissue or deposits thereon incorporate solid state or silicon photomultiplier (SSPM, or SiPM) devices to provide safe, highly sensitive and compact beta and gamma probes or cameras for use in locating the radiation labeled sites within the human body or abnormal labeled sites within the body. The probes may include both gamma and beta detecting components as well as means for enhancing the accuracy and sensitivity of the beta detectors.

Abstract: Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing, and first and second substrates mounted within the housing. Also disposed within the housing is a thermoelectric cooler (TEC) thermally coupled to the first substrate. An optical transmitter is mounted on the first substrate, and thermally coupled to the TEC. A TEC driver is mounted on the second substrate and electrically coupled to the TEC. In some embodiments a thermal resistance mechanism is provided for connecting the first substrate to the second substrate.

Abstract: Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC) thermally coupled to the substrate, the TEC being mounted within the housing; an optical component structurally mounted on the substrate, wherein the optical component is thermally coupled to the TEC; and a TEC driver electrically coupled to the TEC, wherein the TEC driver is configured to electrically drive the TEC, the TEC driver being mounted within the housing.

Abstract: Intraoperative radiation detection probes and cameras for use in surgical or transcutaneous procedures or procedures incorporating probes inserted through body orifices to aid in the location, detection and removal of radiation labeled cells, abnormal tissue or deposits thereon incorporate solid state or silicon photomultiplier (SSPM, or SiPM) devices to provide safe, highly sensitive and compact beta and gamma probes or cameras for use in locating the radiation labeled sites within the human body or abnormal labeled sites within the body. The probes may include both gamma and beta detecting components as well as means for enhancing the accuracy and sensitivity of the beta detectors.

Abstract: In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source.

Abstract: The present invention is directed to instruments and instrumental techniques for locating cancer cells in lymph nodes which utilize a radiation detector operatively connected to an ultrasound probe for locating the exact position of radiation tagged tissue, particularly in sentinel lymph nodes followed by placement of a biopsy device. Also described are unique new interoperative radiation detection probes for use in these techniques which include structure for placement of a biopsy device or biopsy needle into the located lymph node and procedures for removal of small portions of detected radiation emitting sentinel lymph nodes for evaluation in a pathology laboratory by measurement of expressed genes located in the removed tissue. The instruments and instrumental techniques also facilitate the subsequent delivery of materials to reverse the unfavorable immune response or environment conducive for metastasis in the sentinel lymph node once cancer cells are located therein.

Abstract: Intraoperative radiation detection probes and cameras for use in surgical or transcutaneous procedures or procedures incorporating probes inserted through body orifices to aid in the location, detection and removal of radiation labeled cells, abnormal tissue or deposits thereon incorporate solid state or silicon photomultiplier (SSPM, or SiPM) devices to provide safe, highly sensitive and compact beta and gamma probes or cameras for use in locating the radiation labeled sites within the human body or abnormal labeled sites within the body. The probes may include both gamma and beta detecting components as well as means for enhancing the accuracy and sensitivity of the beta detectors.

Abstract: Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC) thermally coupled to the substrate, the TEC being mounted within the housing; an optical component structurally mounted on the substrate, wherein the optical component is thermally coupled to the TEC; and a TEC driver electrically coupled to the TEC, wherein the TEC driver is configured to electrically drive the TEC, the TEC driver being mounted within the housing.

Abstract: An intelligent transmitter module (“ITM”) includes a CDR circuit for equalizing and retiming an electrical data signal, a driver for generating a modulation signal and/or performing waveform shaping of the equalized and retimed signal, and an optical transmitter configured to emit an optical signal representative of the data signal. A linear amplifier may also be included to amplify the modulation signal when the optical transmitter is a laser with managed chirp. Alternately or additionally, a microcontroller with a 14-bit or higher A2D can be included to control and optimize operation of the ITM. In one embodiment, the CDR, driver, linear amplifier, and/or microcontroller are flip chip bonded to a first substrate while the laser with managed chirp is bonded to a second substrate. The first substrate may comprise a multi-layer high frequency laminate.

Abstract: The present invention is directed to instruments and instrumental techniques for locating cancer cells in lymph nodes which utilize a radiation detector operatively connected to an ultrasound probe for locating the exact position of radiation tagged tissue, particularly in sentinel lymph nodes followed by placement of a biopsy device. Also described are unique new interoperative radiation detection probes for use in these techniques which include structure for placement of a biopsy device or biopsy needle into the located lymph node and procedures for removal of small portions of detected radiation emitting sentinel lymph nodes for evaluation in a pathology laboratory by measurement of expressed genes located in the removed tissue. The instruments and instrumental techniques also facilitate the subsequent delivery of materials to reverse the unfavorable immune response or environment conducive for metastasis in the sentinel lymph node once cancer cells are located therein.