Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: The invention relates to an athermal optical waveguide grating device. The optical waveguide grating device includes a fiber Bragg grating secured and bonded to a supporting substrate member with a low thermal expansion securing glass, such as a copper alumino silicate glass. The inventive devices and method of making the devices include the utilization of intermediate solid insert members between the fiber and a negative thermal expansion substrate.

Abstract: Glasses exhibiting low thermal coefficients of elastic modulus, good glass stability, low thermal expansion, and good chemical durability are provided, a first glass type including glasses consisting essentially, in weight percent on the oxide basis, of about 60-64% SiO.sub.2, 14-18% B.sub.2 O.sub.3, 8.5-10% Al.sub.2 O.sub.3, 4-7% Na.sub.2 O, and 2-12% BaO, and a second group comprising alkali silicate glasses consisting essentially, in weight percent on the oxide basis, of about 51-55% SiO.sub.2, 10-13% K.sub.2 O, 5-15% ZnO, 5-15 BaO, and 10-20% PbO.

Abstract: This invention is drawn to thermally devitrifiable sealing glasses capable of forming sound seals with glasses, glass-ceramics, and ceramics having coefficients of thermal expansion (0.degree.-300.degree. C.) between about 0.5-5.times.10.sup.-7 /.degree. C. In finely fritted form, the glasses can be sintered and crystallized in situ at about 900.degree.-1000.degree. C. The glasses consist essentially, expressed in weight percent on the oxide basis, of about 1-2% Li.sub.2 O, 0.7-1.5% MgO, 9-13% ZnO, 19-23% Al.sub.2 O.sub.3, 62-68% SiO.sub.2, and at least 1% K.sub.2 O+Rb.sub.2 O+Cs.sub.2 O in the indicated proportions of 0-3% K.sub.2 O, 0-4% Rb.sub.2 O, and 0-6% Cs.sub.2 O.

Abstract: A die assembly comprises a steel casing shrink-fitted onto and holding a ceramic die nib for extruding, drawing, ironing and the like of ferrous and nonferrous metal stock, especially in hot workable condition. The assembly includes an interlayer between the nib and casing to accommodate imperfect dimensional mating of adjacent shrink-fitted surfaces of the nib and casing. The interlayer is composed of all-crystalline ceramic material having a heating liquidus temperature within the range of 500.degree.-570.degree. C. Rigidity of solidified interlayer maintains uniform shrink-fitted compression on nib during usage of the assembly. Nib and preferred lead-zinc-borate devitrified glass interlayer are easily, jointly removable from casing and leave casing clean for reuse without affecting its case-hardening properties.

Abstract: This invention is directed to the production of glasses having particular utility as envelopes for tungsten-halogen incandescent lamps because of their thermal endurance and capability of use at the high temperatures at which such lamps operate, coupled with their facility for being sealed to molybdenum. The glasses manifest a strain point in excess of 730.degree. C., a liquidus temperature less than 1200.degree. C., a viscosity at the liquidus of at least 40,000 poises, axial compression at room temperature not exceeding 350 PPM and axial tension or compression at 500.degree. C. not exceeding 150 PPM when sealed to molybdenum leads, and a coefficient of thermal expansion (0.degree.-300.degree. C.) less than 48.times.10.sup.-7 /.degree. C. Such glasses consist essentially, by weight on the oxide basis, of 61-65% SiO.sub.2, 14-17% Al.sub.2 O.sub.3, 8-15% CaO, and 6-9% SrO.

Abstract: There is disclosed an improved glass panel for a cathode ray tube adapted to use in color television reception. The panel glass undergoes a minimum amount of compaction on reheating, has a strain point greater than 470.degree. C., a liquidus below 900.degree. C., and a composition selected from a family within the SiO.sub.2 -Al.sub.2 O.sub.3 -MgO-CaO-SrO-BaO-PbO-Na.sub.2 O-K.sub.2 O field. Special additives in minor amounts include TiO.sub.2, CeO.sub.2, Sb.sub.2 O.sub.3, As.sub.2 O.sub.3, F, and oxide colorants.