Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: A local power converter may include a controller to manipulate the operating point of a local power converter to cause the power point tracking feature of a central power converter to operate at a point determined by the controller. In some embodiments, the controller can manipulate the operating point of the local power converter by alternating between at least two modes. In some other embodiments, the controller can manipulate the operating point of the local power converter to provide a substantially constant slope. In some other embodiments, the controller can maintain a substantially constant impedance ratio. In some other embodiments, the controller enables perturbations from the power point tracking feature of the central power converter to reach the power source.

Abstract: In some embodiments, a system includes a power system coupled to a power bus, and a power line communication (PLC) gateway coupled in series with the power bus. In other embodiments, a system includes first and second power circuits coupled in series with a power bus, and first and second power-line communication circuits coupled in series with the power bus. In additional embodiments, a system includes a power converter coupled to a power bus and having one or more switching frequencies, and a power-line communication circuit coupled to the power bus and having one or more communication frequencies, where at least one of the switching frequencies is substantially greater than at least one of the communication frequencies.

Abstract: A local power converter may include a controller to manipulate the operating point of a local power converter to cause the power point tracking feature of a central power converter to operate at a point determined by the controller. In some embodiments, the controller can manipulate the operating point of the local power converter by alternating between at least two modes. In some other embodiments, the controller can manipulate the operating point of the local power converter to provide a substantially constant slope. In some other embodiments, the controller can maintain a substantially constant impedance ratio. In some other embodiments, the controller enables perturbations from the power point tracking feature of the central power converter to reach the power source.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: An electrical assembly may include an enclosure having a base portion to attach the enclosure to a panel and a heat dissipating portion opposite the base portion, a circuit board having a first thermal interface on a first side of the board, a second thermal interface on a second side of the board, and a thermally conductive portion to provide enhanced thermal conduction between the first thermal interface and the second thermal interface, a power electronic device having a thermal interface coupled to the first thermal interface of the circuit board, a heat spreader arranged to transfer heat to the heat dissipating portion of the enclosure, and a thermally conductive pad coupled between the second thermal interface of the circuit board and the heat spreader.

Abstract: In some embodiments, a system includes a power system coupled to a power bus, and a power line communication (PLC) gateway coupled in series with the power bus. In other embodiments, a system includes first and second power circuits coupled in series with a power bus, and first and second power-line communication circuits coupled in series with the power bus. In additional embodiments, a system includes a power converter coupled to a power bus and having one or more switching frequencies, and a power-line communication circuit coupled to the power bus and having one or more communication frequencies, where at least one of the switching frequencies is substantially greater than at least one of the communication frequencies.

Abstract: In some embodiments, a system includes a power system coupled to a power bus, and a power line communication (PLC) gateway coupled in series with the power bus. In other embodiments, a system includes first and second power circuits coupled in series with a power bus, and first and second power-line communication circuits coupled in series with the power bus. In additional embodiments, a system includes a power converter coupled to a power bus and having one or more switching frequencies, and a power-line communication circuit coupled to the power bus and having one or more communication frequencies, where at least one of the switching frequencies is substantially greater than at least one of the communication frequencies.

Abstract: A local power converter may include a controller to manipulate the operating point of a local power converter to cause the power point tracking feature of a central power converter to operate at a point determined by the controller. In some embodiments, the controller can manipulate the operating point of the local power converter by alternating between at least two modes. In some other embodiments, the controller can manipulate the operating point of the local power converter to provide a substantially constant slope. In some other embodiments, the controller can maintain a substantially constant impedance ratio. In some other embodiments, the controller enables perturbations from the power point tracking feature of the central power converter to reach the power source.

Abstract: A projector device employing ballast with a flyback converter is disclosed. For example, one embodiment comprises a lamp driver circuit including a power stage circuit including a flyback converter to output a direct current signal to a bridge circuit, the bridge circuit to reconstruct the direct current signal to an alternating current signal, a control circuit coupled with the power stage circuit and the bridge circuit, the control circuit to receive the direct current signal from the power stage circuit and to provide a frequency control signal to the bridge circuit, and a lamp igniter circuit comprising at least one charge pump and being coupled with the bridge circuit, wherein in response to the frequency control signal being provided to the bridge circuit, the bridge circuit is configured to increase the voltage of the alternating current signal provided to the lamp igniter circuit to power the lamp igniter circuit.

Abstract: A projector device employing ballast with a flyback converter is disclosed. For example, one embodiment comprises a lamp driver circuit including a power stage circuit including a flyback converter to output a direct current signal to a bridge circuit, the bridge circuit to reconstruct the direct current signal to an alternating current signal, a control circuit coupled with the power stage circuit and the bridge circuit, the control circuit to receive the direct current signal from the power stage circuit and to provide a frequency control signal to the bridge circuit, and a lamp igniter circuit comprising at least one charge pump and being coupled with the bridge circuit, wherein in response to the frequency control signal being provided to the bridge circuit, the bridge circuit is configured to increase the voltage of the alternating current signal provided to the lamp igniter circuit to power the lamp igniter circuit.