Abstract: Described is a snap-on buckle. The snap-on buckle comprises a buckle configured to receive an attachment device, the buckle including at least one break away point and a snap, insert molded into the buckle, that is configured to releasably attach to a surface of a mobile terminal. In an alternate embodiment, the snap-on buckle comprises a buckle configured to receive an attachment device, the buckle including at least one break away point and an attachment means, insert molded into the buckle, that is configured to releasably attach to a surface of a mobile terminal.

Abstract: A directional antenna array is provided that includes a driven element and a first parasitic element separated from the driven element with the first parasitic element and/or the driven element having a width that is greater than about one-half a percent (0.5%) of an free-space wavelength of the directional antenna array. Alternatively or in conjunction, the directional antenna array includes a balun structure that is configured to couple the driven element to at least one of an electromagnetic energy source and an electromagnetic sink, and the balun structure includes a dipole structure, a first feed point extending from the dipole structure and a second feed point extending from the first parasitic element.

Abstract: A directional antenna array is provided that includes a driven element and a first parasitic element separated from the driven element with the first parasitic element and/or the driven element having a width that is greater than about one-half a percent (0.5%) of an free-space wavelength of the directional antenna array. Alternatively or in conjunction, the directional antenna array includes a balun structure that is configured to couple the driven element to at least one of an electromagnetic energy source and an electromagnetic sink, and the balun structure includes a dipole structure, a first feed point extending from the dipole structure and a second feed point extending from the first parasitic element.

Abstract: Mirrors having different optical properties are selected to change the cross-section of a beam electro-optical reader for reading bar code symbols.

Abstract: An optical scan module, for example for an optical scanner, includes an integrally molded plastics material member which defines not only the laser focusing lens, but also the laser focusing aperture and the collection mirror. In addition, the molded member may act to house and to locate both a semiconductor laser and a photodetector, thereby ensuring easy and accurate placement of those elements within the scanning assembly. The optical assembly may be in modular form, mounted onto a common printed circuit board with a beam scanner.

Abstract: An optical scan module, for example for an optical scanner, includes an integrally molded plastics material member which defines not only the laser focusing lens, but also the laser focusing aperture and the collection mirror. In addition, the molded member may act to house and to locate both a semiconductor laser and a photodetector, thereby ensuring easy and accurate placement of those elements within the scanning assembly. The optical assembly may be in modular form, mounted onto a common printed circuit board with a beam scanner.

Abstract: An optical scan module, for example for an optical scanner, includes an integrally molded plastics material member which defines not only the laser focusing lens, but also the laser focusing aperture and the collection mirror. In addition, the molded member may act to house and to locate both a semiconductor laser and a photodetector, thereby ensuring easy and accurate placement of those elements within the scanning assembly. The optical assembly may be in modular form, mounted onto a common printed circuit board with a beam scanner.

Abstract: An integrated optical module for an optical scanner has a lens spaced from a vertical-cavity surface-emitting laser (VCSEL) by a spacer of defined dimensions. The module, in an alternative embodiment, includes a wafer frame, a suspended mirror mounted for oscillation on the frame, a wafer substrate bonded beneath the frame and a wafer cover bonded above the frame. The cover includes a mirror travel stop to protect the mirror against shocks. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules.

Abstract: An optical scan module, for example for an optical scanner, includes an integrally molded plastics material member which defines not only the laser focusing lens, but also the laser focusing aperture and the collection mirror. In addition, the molded member may act to house and to locate both a semiconductor laser and a photodetector, thereby ensuring easy and accurate placement of those elements within the scanning assembly. The optical assembly may be in modular form, mounted onto a common printed circuit board with a beam scanner.

Abstract: An integrated optical module for an optical scanner has a lens spaced from a vertical-cavity surface-emitting laser (VCSEL) by a spacer of defined dimensions. The module, in an alternative embodiment, includes a wafer frame, a suspended mirror mounted for oscillation on the frame, a wafer substrate bonded beneath the frame and a wafer cover bonded above the frame. The cover includes a mirror travel stop to protect the mirror against shocks. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules.