Patents by Inventor Henry H. Jung

Henry H. Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid assembly of flip-chip package attached to heat removal device and method of manufacturing same
    Publication number: 20030160319
    Abstract: A flip-chip package assembly having a package substrate having a mounting surface to which a semiconductor die and a heat removal device is selectively mounted is provided. The flip-chip assembly is made out of a package substrate on which a semiconductor die is positioned and a heat removal device which is physically secured to the package substrate. The semiconductor die is thermally connected to the heat removal device through a thermal interface material. Further, a method for manufacturing the flip-chip package described herein is disclosed.
    Type: Application
    Filed: February 27, 2002
    Publication date: August 28, 2003
    Inventors: Wen-Chun Zheng, Henry H. Jung